Abstract: A photodiode device and the manufacturing method of the same are provided. The photodiode device includes a substrate; an epitaxy layer on the substrate, the epitaxy layer including a window layer and a cap layer on the window layer, the cap layer covering a portion of the window layer; and a patterned conductive layer on the cap layer, the patterned conductive layer being formed with a bottom area and a top area wherein the bottom area is greater than the top area.

Abstract: A method of manufacturing photodiode device includes the following steps: providing a wafer having a substrate and an epitaxy layer, the substrate having a first surface and a second surface and the epitaxy layer formed on the first surface; forming a first conductive layer on the second surface of the substrate; forming a patterned conductive layer above the epitaxy layer; and etching the patterned conductive layer by a reactive ion etching (RIE) process performed under argon gas and helium gas.

Abstract: A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.

Abstract: An auto-switching BIOS system and the method thereof, switches to dual BIOS by a hardware control circuit. After the system has been started with the first BIOS to the predetermined period of time and the BIOS_READY signal is detected as disabled, the hardware control circuit switches the system from the first BIOS to the second BIOS and restarts the system with the second BIOS.

Abstract: A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.

Abstract: A method for use in manufacturing a microelectromechanical system, such as a reflective stealth mirror includes the steps of: forming an I-shape mirror structure; forming a spacer layer over the I-shape mirror structure; and patterning the spacer layer to form at least one spacer along a side of the I-shape mirror structure.

Abstract: An in-situ performed method utilizing a pure H2O plasma to remove a layer of resist from a substrate or wafer without substantially accumulating charges thereon. Also, in-situ performed methods utilizing a pure H2O plasma or a pure H2O vapor to release or remove charges from a surface or surfaces of a substrate or wafer that have accumulated during one or more IC fabrication processes.

Abstract: A method for use in manufacturing a microelectromechanical system, such as a reflective stealth mirror includes the steps of: forming an I-shape mirror structure; forming a spacer layer over the I-shape mirror structure; and patterning the spacer layer to form at least one spacer along a side of the I-shape mirror structure.

Abstract: A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

Abstract: A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

Abstract: A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.

Abstract: A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.