Abstract: The present application relates to a secondary battery, a battery module and an apparatus. The secondary battery includes an electrode assembly and a casing. The electrode assembly includes a main body portion and a tab portion, the tab portion extending out from the main body portion along an end of the main body portion and including an outer peripheral surface. The casing includes an accommodating hole for accommodating the electrode assembly. The casing includes a limiting protrusion. The outer peripheral surface extends around an axis of the accommodating hole. The limiting protrusion protrudes toward the tab portion and presses against the outer peripheral surface of the tab portion. The limiting protrusion is adapted to limit a position of the tab portion. The secondary battery provided by the present application can reduce the possibility of fatigue fracture of the adapting piece.

Abstract: A one-time activation smoke alarm includes a smoke alarm body and a wall-hanging base. The smoke alarm body includes a case and a sliding sheet. An engaging recessed slot and a supporting protrusion platform are respectively formed on two sides of a bottom of the case. The sliding sheet is slidably disposed on the supporting protrusion platform, and a front end of the sliding sheet has a pressed protrusion portion that extends into the engaging recessed slot. An engaging protrusion platform is formed on the wall-hanging base, and at least one abutting protrusion portion protrudes outward from a periphery of the engaging protrusion platform. The engaging protrusion platform and the engaging recessed slot are capable of being engaged and fixed together such that the abutting protrusion portion abuts the pressed protrusion portion and the smoke alarm body activates a detection function.

Abstract: A smoke alarm having a layered structure includes a case, a smoke detecting unit, and a layering plate. The smoke detecting unit is disposed in the case, and includes a smoke collecting box and a control module electrically connected to the smoke collecting box. The layering plate is disposed in the case. The layering plate defines an upper layer space and a lower layer space in the case, the upper layer space is a smoke guiding space, and the smoke collecting box is accommodated in the upper layer space to facilitate smoke-containing air to flow to the smoke collecting box. The lower layer space is a module mounting space, and the control module is accommodated in the lower layer space to facilitate mounting of a sub-module of the control module that is detachable.

Abstract: An interactive image marking method is introduced. The interactive image marking method includes the following steps, displaying a target image and at least one marked region in the target image; receiving an interactive signal, where the interactive signal corresponds to a first pixel of the target image; calculating a correlation between the first pixel and pixels of the target image, and determining a correlation range in the target image according to the correlation; editing the marked region according to the correlate range; and displaying the edited marked region. In addition, an electronic device and a recording medium using the method are also introduced.

Abstract: Photonic integrated circuits and optical couplers with improved process tolerance, and methods of forming the same, are disclosed herein. In one example, an integrated circuit package includes a photonic integrated circuit (PIC) to send or receive optical signals and an optical coupler to optically couple the PIC to one or more optical fibers. The PIC includes a first interface with at least two recesses and one or more grooves positioned between the recesses, and the optical coupler includes a second interface with at least two protrusions and one or more ridges positioned between the protrusions (or vice versa). The protrusions on the optical coupler are mated with the recesses on the PIC, and the ridges on the optical coupler are mated with the grooves on the PIC.

Abstract: A light-emitting diode includes a light-emitting epitaxial layer having a first surface as a light-emitting surface and a second surface opposing the first surface, a first type semiconductor layer, an active layer, and a second type semiconductor layer; a transparent dielectric layer located on the second surface and in direct contact with the light-emitting epitaxial laminated layer, and having conductive through-holes therein; a transparent conductive layer located on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; and a metal reflective layer located on one side surface of the transparent conductive layer that is distal from the transparent dielectric layer; wherein the transparent dielectric layer includes a first layer and a second layer; and wherein the first layer is thicker than the second layer, and a refractivity of the first layer is less than a refractivity of the second layer.

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

Abstract: An optical system is provided. The optical system includes a movable part, a fixed part, and a first driving assembly, and a second driving assembly. The movable part connects an optical element. The movable part is movable relative to the fixed part. The first driving assembly and the second driving assembly is for driving the movable part to move. The first driving assembly generates a first driving force to drive the movable part to move in a first dimension. The second driving assembly generates a second driving force to drive the movable part to move in a second dimension.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.

Abstract: The present application relates to a secondary battery, a battery module and an apparatus. The secondary battery includes an electrode assembly and a casing. The electrode assembly includes a main body portion and a tab portion, the tab portion extending out from the main body portion along an end of the main body portion and including an outer peripheral surface. The casing includes an accommodating hole for accommodating the electrode assembly. The casing includes a limiting protrusion. The outer peripheral surface extends around an axis of the accommodating hole. The limiting protrusion protrudes toward the tab portion and presses against the outer peripheral surface of the tab portion. The limiting protrusion is adapted to limit a position of the tab portion. The secondary battery provided by the present application can reduce the possibility of fatigue fracture of the adapting piece.

Abstract: In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.

Abstract: A semiconductor structure that includes a first semiconductor fin and a second semiconductor fin disposed over a substrate and adjacent to each other, a metal gate stack disposed over the substrate, and source/drain features disposed in each of the first semiconductor fin and the second semiconductor fin to engage with the metal gate stack. The metal gate stack includes a first region disposed over the first semiconductor fin, a second region disposed over the second semiconductor fin, and a third region connecting the first region to the second region in a continuous profile, where the first region is defined by a first gate length and the second region is defined by a second gate length less than the first gate length.

Abstract: The disclosure discloses an image display method, an image display device and a display system. The method includes: according to a image to be displayed, determining a maximum brightness value of pixel points in a panel partition to obtain a backlight brightness value corresponding to a backlight partition; acquiring a light diffusion curve of the backlight of the backlight partition incident on the panel partition corresponding to the backlight partition; calculating a compensation ratio of a target pixel to the light diffusion curve, the compensation ratio is a ratio of the maximum brightness value to an actual brightness value; calculating a pixel compensation value of the target pixel according to the image to be displayed and the compensation ratio; adjusting a pixel value of the target pixel point according to the pixel compensation value.

Abstract: A carry-lookahead adder is provided. A first mask unit performs first mask operation on first input data with the first mask value to obtain first masked data. A second mask unit performs second mask operation on second input data with the second mask value to obtain second masked data. A first XOR gate receives the first and second mask values to provide a variable value. A half adder receives the first and second masked data to generate a propagation value and an intermediate generation value. A third mask unit performs third mask operation on the propagation value with the third mask value to obtain the third masked data. A carry-lookahead generator provides the carry output and the carry value according to carry input, the generation value, and the propagation value. The second XOR gate receives the third masked data and the carry value to provide the sum output.

Abstract: The present disclosure relates to an anti-fatigue Lactobacillus composition. The anti-fatigue Lactobacillus composition, which includes at least one of Lactobacillus brevis GKEX, Lactobacillus plantarum GKK1 and Lactobacillus johnsonii GKJ2 as an active ingredient, administered to a healthy subject for a continuous period of time, can significantly improve fatigue-related biochemical indices and prolong aerobic exercise time to exhaustion, and thus can be used as an active ingredient for preparation of various compositions for anti-fatigue and/or improving athletic ability.

Abstract: A semiconductor device comprises a first gate electrode on a substrate, a first conductive contact on the first gate electrode, an etch stop layer (ESL) on the first conductive contact, and a second conductive contact extending through the ESL. The first conductive contact has a first width. The second conductive contact has a second width, the second width being smaller than the first width. The ESL overhangs a portion of the second conductive contact. A convex bottom surface of the second conductive contact physically contacts a concave top surface of the first conductive contact.

Abstract: The present disclosure provides an automatic die pick-and-place apparatus and a formation method. The apparatus includes a main body; a suction nozzle rod installed on the main body; a clamping strip disposed above the main body, where a front end of the clamping strip extends outward from the main body; and a guiding assembly disposed on a front end surface of the main body and on two sides of the suction nozzle rod. The first spring is vertically disposed and connected between the clamping strip and a lower portion of the main body; an installation groove is formed on the front end surface of the main body; a magnetic block is inserted in the installation groove; a magnetic installation block is sleeved on the suction nozzle rod and attracted to be connected to the magnetic block; and a limiting block is installed on a front portion of the main body.

Abstract: A method and structure for forming semiconductor device includes forming a first opening in a dielectric layer to expose a source/drain region. In some embodiments, the method further includes depositing a first metal layer in the opening and over the source/drain region. Thereafter, in some examples, the method further includes performing an annealing process to modulate a grain size of the first metal layer. In various embodiments, the method further includes depositing a second metal layer over the annealed first metal layer. In some embodiments, the second metal layer has a substantially uniform phase.