Patents by Inventor Shan-Yi Tseng

Shan-Yi Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10104778
    Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 16, 2018
    Assignee: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Pei-Hao Hung, Wen-Chien Hsu, Meng-Huan Chia, Min-Ming Tsai, Shan-Yi Tseng, Yuan-Chih Lee
  • Publication number: 20180146552
    Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.
    Type: Application
    Filed: February 21, 2017
    Publication date: May 24, 2018
    Applicant: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Pei-Hao Hung, Wen-Chien Hsu, Meng-Huan Chia, Min-Ming Tsai, Shan-Yi Tseng, Yuan-Chih Lee
  • Patent number: 9860978
    Abstract: A rigid-flex board structure includes a flexible printed circuit (FPC) board, a substrate, a reinforcing layer, a patterned circuit layer and a plurality of conductive vias. The FPC board includes at least one exposing area. The substrate is disposed on the FPC board and includes an opening exposing the exposing area. The reinforcing layer is embedded in the substrate and a rigidity of a material of the reinforcing layer is greater than a rigidity of a material of the substrate. The patterned circuit layer is disposed on the substrate. The conductive vias are configured to electrically connect the patterned circuit layer and the FPC board.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: January 2, 2018
    Assignee: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Pei-Hao Hung, Ying-Hsing Chen, Chiu-Pei Huang, Min-Ming Tsai, Shan-Yi Tseng, Yuan-Chih Lee