Patents by Inventor Shan YIN

Shan YIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913726
    Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 27, 2024
    Assignee: Cooler Master Co., Ltd.
    Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
  • Publication number: 20230272980
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
  • Patent number: 11732981
    Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: August 22, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia-Yu Lin, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
  • Patent number: 11725885
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: August 15, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11713927
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: August 1, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen Chen, Shan-Yin Cheng
  • Patent number: 11692777
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: July 4, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11686532
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: June 27, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
  • Publication number: 20230165340
    Abstract: In a method and device for extracting joint line of shoe, a contact end of a contouring tool is provided to contact a joint contour of a shoe sample, an encoder is provided to generate a plurality of first trajectory coordinate signals of the contact end while the contact end is moved along the joint contour, and a signal processor is provided to receive the first trajectory coordinate signals to create a digital joint line.
    Type: Application
    Filed: November 26, 2021
    Publication date: June 1, 2023
    Inventors: Cheng-Chang Chiu, Chun-Ming Yang, Chia-Pin Lin, Ping-Tzan Huang, Hong-Ren Zhang, Yan-Jun Chen, Wan-Shan Yin
  • Patent number: 11625490
    Abstract: Privacy protection methods, systems, and apparatus, including computer programs encoded on computer storage media, are provided. One of the methods is performed by a second computing device and includes: receiving a data request for object data from a first computing device, wherein the object data is associated with an object and is stored in the second computing device; performing encryption of the object data using a public key associated with the object based on the data request to generate a first ciphertext; obtaining verification data based on the first ciphertext for verifying whether a ciphertext to be verified corresponds to the object data; and sending the verification data to the first computing device for the first computing device to execute a cryptography protocol with a third computing device based on the verification data.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: April 11, 2023
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Lichun Li, Shan Yin, Zheng Liu
  • Patent number: 11598588
    Abstract: A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11598587
    Abstract: A method includes providing a first metal sheet and a second metal sheet, printing a channel pattern on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, forming a plurality of channels by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, sealing the first metal sheet and the second metal sheet, and forming a plurality of through holes in locations where the first metal sheet and the second metal sheet are bonded to each other. The plurality of through holes are arranged in a plurality of rows, each row including at least two through holes, and each location where the first metal sheet and the second metal sheet are bonded to each other includes a single through hole of the plurality of through holes.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Publication number: 20230063953
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 2, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen CHEN, Shan-Yin CHENG
  • Publication number: 20230055907
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.
    Type: Application
    Filed: November 8, 2022
    Publication date: February 23, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen CHEN, Shan-Yin CHENG
  • Publication number: 20230003460
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 5, 2023
    Inventors: Chia Yu LIN, Shan-Yin CHENG
  • Publication number: 20230003459
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 5, 2023
    Inventors: Chia Yu LIN, Shan-Yin Cheng
  • Patent number: 11530879
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: December 20, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11525632
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: December 13, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen Chen, Shan-Yin Cheng
  • Patent number: 11481775
    Abstract: A method for implementing blockchain-based transactions comprises: determining a transaction amount to be remitted from a remitter's blockchain account into a receiver's blockchain account, wherein a balance of the remitter's blockchain account comprises multiple reserve balances, and commitments of the reserve balances are recorded in a blockchain; selecting one or more of the reserve balances from the remitter's blockchain account, wherein the sum of the selected one or more reserve balances is not smaller than the transaction amount; and submitting to the blockchain a transaction comprising an identification of each of the selected one or more reserve balances and a commitment of the transaction amount, for the selected one or more reserve balances to be removed from the remitter's blockchain account and the transaction amount to be added to the receiver's blockchain account.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: October 25, 2022
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Lichun Li, Wenbin Zhang, Baoli Ma, Zheng Liu, Shan Yin
  • Publication number: 20220299277
    Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
    Type: Application
    Filed: June 7, 2022
    Publication date: September 22, 2022
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chia-Yu LIN, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
  • Publication number: 20220299271
    Abstract: A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 22, 2022
    Inventors: Chia Yu LIN, Shan-Yin CHENG