Abstract: The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

Abstract: The present invention relates to a method for drilling a printed circuit board, comprising: drilling down in an initial position, and when contacting a live superficial conductive layer of a PCB, acquiring a first conductive position and acquiring a first height difference between the initial position and the first conductive position; drilling onward after the first drill bit of the driller drills through the superficial conductive layer and when contacting another conductive layer of the PCB, acquiring a second conductive position and acquiring a second height difference between the initial position and the second conductive position; calculating a difference between the second and the first height difference to obtain a third height difference; and performing back-drilling, according to the third height difference, in a position that needs back-drilling. The present invention acquires precise depth information through a test blind via and reduces Stub length of back-drilling.

Abstract: The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

Abstract: The present invention relates to a method for drilling a printed circuit board, comprising: drilling down in an initial position, and when contacting a live superficial conductive layer of a PCB, acquiring a first conductive position and acquiring a first height difference between the initial position and the first conductive position; drilling onward after the first drill bit of the driller drills through the superficial conductive layer and when contacting another conductive layer of the PCB, acquiring a second conductive position and acquiring a second height difference between the initial position and the second conductive position; calculating a difference between the second and the first height difference to obtain a third height difference; and performing back-drilling, according to the third height difference, in a position that needs back-drilling. The present invention acquires precise depth information through a test blind via and reduces Stub length of back-drilling.