Patents by Inventor Shane Harrah

Shane Harrah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8866168
    Abstract: The present invention provides a multicolor LED assembly packaged with improved and controlled color mixing to create a more uniform color mixture. The assembly includes at least one lens overlying an encapsulant which encapsulates a plurality of LED dies. The lens includes a top surface and a bottom surface with the contour of the bottom surface designed to redirect light from each of the LED dies in different directions towards the top surface of the lens. The contoured shaped of the bottom surface of the lens redirects light from each of the plurality of LED dies such that illuminance and luminous intensity distributions of the plurality of LED dies substantially overlap, wherein the deviation from complete overlap is less than a predetermined amount which is substantially imperceptible to the average human eye.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: October 21, 2014
    Assignee: Lighting Science Group Corporation
    Inventors: Edward Bailey, Shane Harrah
  • Patent number: 8222652
    Abstract: A method for controlling color accuracy of a light-emitting semiconductor-based device, and a process for producing a light-emitting semiconductor-based device with desired color accuracy is disclosed. The color accuracy is controlled by defining a desired color accuracy of a light produced by mixing colors emitted by at least two light sources over a first range of operating conditions; determining characteristics of the light as a function of operating conditions; and establishing desired light characteristics of the at least two light sources over a second range of operating condition in accordance with the step of defining and the step of determining.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: July 17, 2012
    Assignee: Bridgelux, Inc.
    Inventors: Shane Harrah, David Hum
  • Patent number: 8193557
    Abstract: A sub-assembly of a light-emitting device package and/or a light-emitting device package, the package comprising a cavity filled with an encapsulant, are disclosed with means preventing the encapsulant delamination. The means comprise an expansion volume within the light-emitting device package, together with means allowing the encapsulant to flow from the cavity into the expansion volume as the encapsulant expands, and to flow back into the cavity as the encapsulant contracts during heating and cooling of the light-emitting device package.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: June 5, 2012
    Assignee: Bridgelux, Inc.
    Inventor: Shane Harrah
  • Publication number: 20110254027
    Abstract: A method for controlling color accuracy of a light-emitting semiconductor-based device, and a process for producing a light-emitting semiconductor-based device with desired color accuracy is disclosed. The color accuracy is controlled by defining a desired color accuracy of a light produced by mixing colors emitted by at least two light sources over a first range of operating conditions; determining characteristics of the light as a function of operating conditions; and establishing desired light characteristics of the at least two light sources over a second range of operating condition in accordance with the step of defining and the step of determining.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 20, 2011
    Inventors: Shane Harrah, David Hum
  • Publication number: 20110255263
    Abstract: A sub-assembly of a light-emitting device package and/or a light-emitting device package, the package comprising a cavity filled with an encapsulant, are disclosed with means preventing the encapsulant delamination. The means comprise an expansion volume within the light-emitting device package, together with means allowing the encapsulant to flow from the cavity into the expansion volume as the encapsulant expands, and to flow back into the cavity as the encapsulant contracts during heating and cooling of the light-emitting device package.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 20, 2011
    Inventor: Shane HARRAH
  • Publication number: 20110062482
    Abstract: A light-emitting device having multiple light-emitting diode (“LED”) dice organized in an array capable of configuring LED dice in series, parallel, and/or a combination of series and parallel via metal traces is disclosed. In one aspect, the light-emitting device includes a substrate, a dielectric layer, an LED array, and a metal trace. The dielectric layer, which is disposed over the substrate, provides electric insulation. The LED array capable of generating light is able to enhance flexibility of LED connections using a metal trace. The metal trace has a predefined shape configured to travel through the LED array for facilitating electric connections.
    Type: Application
    Filed: January 20, 2010
    Publication date: March 17, 2011
    Applicant: Bridgelux, Inc.
    Inventors: Michael Solomensky, Shane Harrah, Rene Peter Helbing
  • Patent number: 7906794
    Abstract: The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around the one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein this cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame defines one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity.
    Type: Grant
    Filed: July 4, 2007
    Date of Patent: March 15, 2011
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Shane Harrah, Ingo Speier, Philippe Schick
  • Patent number: 7719021
    Abstract: A method for making an efficient light emitting diode (LED) assembly by providing a thermally conductive base having a surface cavity, disposing a reflective paste in the surface cavity, and shaping the reflective paste to form a reflective cavity. The reflective cavity is shaped such that there is a mounting region and at least one reflective side wall at least partially surrounding the mounting region. Once shaped, the reflective paste is fired to set the reflective cavity in its shaped form. Next, one or more LED die may be mounted on the mounting region of the reflective cavity such that the emitted light is reflected by the side walls, thus increasing the light output of the LED assembly.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: May 18, 2010
    Assignee: Lighting Science Group Corporation
    Inventors: Shane Harrah, Greg Blonder
  • Patent number: 7633093
    Abstract: An optical light engine is fabricated by providing a thermally conductive base having one or more mounting pedestals for elevating one or more LED die above the base's surface. The LED die are mounted on the pedestals, electrically connected, and a mold having a molding surface for molding a dome centered around the LED die is disposed on the base over the pedestal-mounted LED die. The encapsulating material is then injected through an input port disposed in the base to mold the dome around the LED die. The encapsulant material is cured and the mold is removed. In an advantageous embodiment, the light engine comprises a ceramic-coated metal base made by the low temperature co-fired ceramic-on-metal process (LTCC-M).
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: December 15, 2009
    Assignee: Lighting Science Group Corporation
    Inventors: Greg Blonder, Shane Harrah
  • Patent number: 7631986
    Abstract: The present invention provides a lighting device package that is configured to enable degassing of the lighting device package. The lighting device package comprises a substrate upon which is operatively mounted one or more light-emitting elements and a retaining structure which is coupled to the substrate and configured to circumscribe the one or more light-emitting elements. In addition, the lighting device package includes an optically transmissive element, wherein two or more supports are configured to provide a separation between the optically transmissive element and the substrate or retaining structure. The volume defined by the substrate, retaining structure and the optically transmissive element, is partially or completely filled with an encapsulation material, thereby forming the lighting device package.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: December 15, 2009
    Assignee: Koninklijke Philips Electronics, N.V.
    Inventor: Shane Harrah
  • Publication number: 20090008662
    Abstract: The invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate; a compound lens disposed to interact with light emitted by the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light-emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Inventors: Ian Ashdown, Shane Harrah
  • Publication number: 20080180960
    Abstract: The present invention provides a lighting device package that is configured to enable degassing of the lighting device package. The lighting device package comprises a substrate upon which is operatively mounted one or more light-emitting elements and a retaining structure which is coupled to the substrate and configured to circumscribe the one or more light-emitting elements. In addition, the lighting device package includes an optically transmissive element, wherein two or more supports are configured to provide a separation between the optically transmissive element and the substrate or retaining structure. The volume defined by the substrate, retaining structure and the optically transmissive element, is partially or completely filled with an encapsulation material, thereby forming the lighting device package.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 31, 2008
    Inventor: Shane Harrah
  • Publication number: 20080062701
    Abstract: A method for making an efficient light emitting diode (LED) assembly by providing a thermally conductive base having a surface cavity, disposing a reflective paste in the surface cavity, and shaping the reflective paste to form a reflective cavity. The reflective cavity is shaped such that there is a mounting region and at least one reflective side wall at least partially surrounding the mounting region. Once shaped, the reflective paste is fired to set the reflective cavity in its shaped form. Next, one or more LED die may be mounted on the mounting region of the reflective cavity such that the emitted light is reflected by the side walls, thus increasing the light output of the LED assembly.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 13, 2008
    Applicant: Lamina Lighting, Inc.
    Inventors: Shane Harrah, Greg Blonder
  • Publication number: 20080054288
    Abstract: The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around the one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein this cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame defines one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity.
    Type: Application
    Filed: July 4, 2007
    Publication date: March 6, 2008
    Applicant: TIR TECHNOLOGY LP
    Inventors: Shane HARRAH, Ingo SPEIER, Philippe SCHICK
  • Publication number: 20070268694
    Abstract: The present invention provides a multicolor LED assembly packaged with improved and controlled color mixing to create a more uniform color mixture. The assembly includes at least one lens overlying an encapsulant which encapsulates a plurality of LED dies. The lens includes a top surface and a bottom surface with the contour of the bottom surface designed to redirect light from each of the LED dies in different directions towards the top surface of the lens. The contoured shaped of the bottom surface of the lens redirects light from each of the plurality of LED dies such that illuminance and luminous intensity distributions of the plurality of LED dies substantially overlap, wherein the deviation from complete overlap is less than a predetermined amount which is substantially imperceptible to the average human eye.
    Type: Application
    Filed: April 18, 2007
    Publication date: November 22, 2007
    Applicant: LAMINA CERAMICS, INC.
    Inventors: Edward Bailey, Shane Harrah
  • Publication number: 20060186423
    Abstract: An optical light engine is fabricated by providing a thermally conductive base having one or more mounting pedestals for elevating one or more LED die above the base's surface. The LED die are mounted on the pedestals, electrically connected, and a mold having a molding surface for molding a dome centered around the LED die is disposed on the base over the pedestal-mounted LED die. The encapsulating material is then injected through an input port disposed in the base to mold the dome around the LED die. The encapsulant material is cured and the mold is removed. In an advantageous embodiment, the light engine comprises a ceramic-coated metal base made by the low temperature co-fired ceramic-on-metal process (LTCC-M).
    Type: Application
    Filed: January 31, 2006
    Publication date: August 24, 2006
    Inventors: Greg Blonder, Shane Harrah
  • Patent number: 6936855
    Abstract: A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: August 30, 2005
    Inventor: Shane Harrah
  • Patent number: 6498355
    Abstract: A light emitting diode array in accordance with the present invention includes a metal substrate, a dielectric layer disposed above the metal substrate, and a plurality of electrically conductive traces disposed on the dielectric layer. A plurality of vias pass through the dielectric layer. The light emitting diode array also includes a plurality of light emitting diodes, each of which is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact electrically coupled to separate ones of the electrically conductive traces. Each of the vias contains a thermally conductive material in thermal contact with the metal substrate and in thermal contact with the corresponding light emitting diode.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: December 24, 2002
    Assignee: Lumileds Lighting, U.S., LLC
    Inventors: Shane Harrah, Douglas P. Woolverton
  • Patent number: 5475241
    Abstract: A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive. LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: December 12, 1995
    Assignee: Hewlett-Packard Company
    Inventors: Shane Harrah, Trevor J. Smith, John Uebbing, Thomas Fajardo, Jerry D. Kreger
  • Patent number: 5265792
    Abstract: A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.
    Type: Grant
    Filed: August 20, 1992
    Date of Patent: November 30, 1993
    Assignee: Hewlett-Packard Company
    Inventors: Shane Harrah, Trevor J. Smith, John Uebbing, Thomas Fajardo, Jerry D. Kreger