Abstract: A rotary dinnerware washing apparatus includes a housing defining therein a washing chamber, a washing mechanism mounted in the housing for spaying hot water over the washing chamber, and a rotating rack rotatably mounted in the washing chamber, a power drive arranged below the washing chamber for rotating the rotating rack in the washing chamber. The rotating rack has partitions radially suspending in the washing chamber and respectively kept in contact with the peripheral wall of the washing chamber and dividing the washing chamber into multiple separately enclosed zones, for example, two cleaning zones, two buffer zones at two opposite lateral sides of the cleaning zones and one dinnerware access zone between the buffer zones.

Abstract: A method for cleaning dinnerware includes the steps of aligning and/or registering items to be cleaned from a standby zone, moving the items continuously from the standby zone one by one into a wash zone in a way that the items each have a cleaning posture relative to a path along which the items march, washing the items processionally by using cleaning fluid, and sorting or collecting the items in order for reuse by diners directly. The dishwasher employing the aforesaid method has functions of auto-collecting and washing the to-be-cleaned dinnerware and sorting or collecting thus obtained dinnerware, and is compact in size such that the dishwasher can be directly installed at a location in proximity to a dining area for enabling the diners to conveniently take out the newly cleaned dinnerware at any time. The dishwasher has a good cleaning efficiency and a low operating cost.

Abstract: A rotary dinnerware washing apparatus includes a housing defining therein a washing chamber, a washing mechanism mounted in the housing for spaying hot water over the washing chamber, and a rotating rack rotatably mounted in the washing chamber, a power drive arranged below the washing chamber for rotating the rotating rack in the washing chamber. The rotating rack has partitions radially suspending in the washing chamber and respectively kept in contact with the peripheral wall of the washing chamber and dividing the washing chamber into multiple separately enclosed zones, for example, two cleaning zones, two buffer zones at two opposite lateral sides of the cleaning zones and one dinnerware access zone between the buffer zones.

Abstract: A method for cleaning dinnerware includes the steps of aligning and/or registering items to be cleaned from a standby zone, moving the items continuously from the standby zone one by one into a wash zone in a way that the items each have a cleaning posture relative to a path along which the items march, washing the items processionally by using cleaning fluid, and sorting or collecting the items in order for reuse by diners directly. The dishwasher employing the aforesaid method has functions of auto-collecting and washing the to-be-cleaned dinnerware and sorting or collecting thus obtained dinnerware, and is compact in size such that the dishwasher can be directly installed at a location in proximity to a dining area for enabling the diners to conveniently take out the newly cleaned dinnerware at any time. The dishwasher has a good cleaning efficiency and a low operating cost.

Abstract: Disclosed are a method and system for removing scratches from a planar panel of translucent or transparent material, such as glass, without removal from its frame. A heat source supplying a controlled amount of heat is moved across the surface of the planar panel at a controlled velocity and at a controlled distance from the surface so as to progressively melt a thin surface layer at portions of the surface heated by the moving heat source. The melted material re-flows under surface tension to smooth scratches in the surface layer. Movement of the heat source is repeated over different portions of the surface until all scratched areas have been treated. The treated panels have a smooth surface with scratches removed, and have good optical and structural qualities.

Abstract: Disclosed are a method and system for removing scratches from a planar panel of translucent or transparent material, such as glass, without removal from its frame. A heat source supplying a controlled amount of heat is moved across the surface of the planar panel at a controlled velocity and at a controlled distance from the surface so as to progressively melt a thin surface layer at portions of the surface heated by the moving heat source. The melted material re-flows under surface tension to smooth scratches in the surface layer. Movement of the heat source is repeated over different portions of the surface until all scratched areas have been treated. The treated panels have a smooth surface with scratches removed, and have good optical and structural qualities.

Abstract: An apparatus for cutting chips from a workpiece includes a cutting tool having a rake face and a flank face, the rake face including a cutting edge. A chip breaker is positioned adjacent the rake face for lifting a chip from the rake face after the chip is cut from the workpiece. A supply head is positioned adjacent the chip breaker and a chamber for receiving cryogenic coolant may be formed between the supply head and the chip breaker. A primary nozzle is positioned for directing cryogenic coolant from the chamber onto the rake face and under the chip cut from the workpiece. The primary nozzle may be formed by one or more nozzle channels recessed into the rake face of the cutting tool.

Abstract: Disclosed is apparatus comprising an electrostatic cassette assembly for securing a semiconductor wafer during lithographic processing such as direct-write particle-beam lithography. The cassette assembly comprises a cassette body and an electrostatic chuck installable in, and removeable from, the cassette body. The electrostatic chuck comprises a charge plate having a thin dielectric layer on its upper surface, against which the wafer is flattened by Coulombic force. Charge storage means are included for maintaining an electrical potential difference between the wafer and the charge plate even in the absence of connection to a source of electrical energy external to the assembly.

Abstract: Disclosed is apparatus comprising an electrostatic cassette assembly for securing a semiconductor wafer during lithographic processing such as direct-write particle-beam lithography. The cassette assembly comprises a cassette body and an electrostatic chuck installable in, and removeable from, the cassette body. The electrostatic chuck comprises a charge plate having a thin dielectric layer on its upper surface, against which the wafer is flattened by Coulombic force. Charge storage means are included for maintaining an electrical potential difference between the wafer and the charge plate even in the absence of connection to a source of electrical energy external to the assembly.