Patents by Inventor Shang-Cheng Liu

Shang-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200031662
    Abstract: A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Inventors: YEN-CHENG LIU, CHENG-YU HSIEH, SHANG-YING TSAI, KUEI-SUNG CHANG
  • Publication number: 20200033700
    Abstract: A driving system for moving several optical elements is provided, including a first module and a second module arranged in a first direction. The first module has a first terminal on a first side thereof to electrically connect to an external circuit. The second module has a second terminal on a second side thereof to electrically connect to the external circuit. The first and second sides are adjacent to each other and parallel to the first direction.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Inventors: Fu-Yuan WU, Shang-Yu HSU, Yu-Cheng LIN, Yung-Ping YANG, Wen-Yen HUANG, Tsung-Han WU, Yi-Chun CHENG, Chen-Chi KUO, Chia-Hsiu LIU, Ichitai MOTO, Sin-Jhong SONG
  • Publication number: 20200033552
    Abstract: An optical module is provided, including a movable portion, a fixed portion and a driving assembly. The movable portion is used to hold an optical element having an optical axis. The movable portion is movably connected to the fixed portion. The driving assembly disposed in the fixed portion to drive the movable portion to move along the optical axis relative to the fixed portion. The driving assembly includes a first magnetic element and a second magnetic element. The first magnetic element and the second magnetic element are aligned along the optical axis. The size of the first magnetic element and the size of the second magnetic element along the optical axis are different.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Inventors: Fu-Yuan WU, Shang-Yu HSU, Yu-Cheng LIN, Yung-Ping YANG, Wen-Yen HUANG, Tsung-Han WU, Yi-Chun CHENG, Chen-Chi KUO, Chia-Hsiu LIU, Ichitai MOTO, Sin-Jhong SONG
  • Publication number: 20200033626
    Abstract: An optical module includes a first side and a second side, and includes a movable portion, a fixed portion, a driving portion, a position-sensing portion, and a circuit board. The movable portion includes a holder for holding an optical element with an optical axis. The fixed portion includes a base and a circuit component, wherein the circuit component has an external electrical connection portion, and the movable portion is movably connected to the fixed portion. The driving portion is configured to drive the movable portion to move relative to the fixed portion. The position-sensing portion includes a position-sensing element, and the position-sensing element is configured to sense the position of the movable portion relative to the fixed portion.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Inventors: Fu-Yuan WU, Shang-Yu HSU, Yu-Cheng LIN, Yung-Ping YANG, Wen-Yen HUANG, Tsung-Han WU, Yi-Chun CHENG, Chen-Chi KUO, Chia-Hsiu LIU, Ichitai MOTO, Sin-Jhong SONG
  • Publication number: 20200036301
    Abstract: An optical member driving mechanism for driving an optical member having an optical axis is provided, including a fixed portion, a movable portion, a first elastic member, and a driving assembly. The movable portion is configured to hold the optical member, and is movably connected the fixed portion via the first elastic member. The driving assembly drives the movable portion to move along the optical axis within a range of motion. The range of motion includes a first limit moving range and a second limit moving range. The first limit moving range is the maximum distance that the movable portion can move toward the light-entering side, and the second limit moving range is the maximum distance that the movable portion can move toward the light-emitting side. When the movable portion is in a predetermined position, the first limit moving range is greater than the second limit moving range.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Inventors: Fu-Yuan WU, Shang-Yu HSU, Yu-Cheng LIN, Yung-Ping YANG, Wen-Yen HUANG, Tsung-Han WU, Yi-Chun CHENG, Chen-Chi KUO, Chia-Hsiu LIU, Ichitai MOTO, Sin-Jhong SONG
  • Publication number: 20200006543
    Abstract: A high electron mobility transistor, includes a substrate; a channel layer formed on the substrate; a barrier layer formed on the channel layer; a source electrode and a drain electrode formed on the barrier layer; a depletion layer formed on the barrier layer and between the source electrode and the drain electrode, wherein a material of the depletion layer comprises boron nitride or zinc oxide; and a gate electrode formed on the depletion layer.
    Type: Application
    Filed: June 26, 2019
    Publication date: January 2, 2020
    Inventors: Shang-Ju TU, Chia-Cheng LIU, Tsung-Cheng CHANG, Ya-Yu YANG, Yu-Jiun SHEN, Jen-Inn CHYI
  • Patent number: 10509193
    Abstract: A driving mechanism includes a frame, a carrying base, and a drive module. The carrying base is disposed in the frame, and includes a carrying body, a first stop element and a second stop element. The carrying body is configured to carry an optical element. The first stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in a first direction. The second stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in the first direction. The driving module is disposed in the frame, and configured to move the carrying body relative to the frame. The first direction is parallel to the axis of the optical element, and the first stop element is closer to the top portion of the frame than the second stop element.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 17, 2019
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Publication number: 20190341479
    Abstract: A nitride semiconductor epitaxial stack structure including: a silicon substrate; an AlN nucleation layer disposed on the silicon substrate; a buffer structure disposed on the aluminum-including nucleation layer and sequentially including a first superlattice epitaxial structure, a first GaN-based layer disposed on the first superlattice epitaxial structure, and a second superlattice epitaxial structure disposed on the first GaN based layer; a channel layer disposed on the buffer structure; and a barrier layer disposed on the channel layer; wherein the first superlattice epitaxial structure includes a first average Al composition ratio, the first GaN-based layer includes a first Al composition ratio, the_second superlattice epitaxial structure includes a second average Al composition ratio; wherein an Al composition ratio of the AlN nucleation layer?the first average Al composition ratio of the first superlattice epitaxial structure>the first Al composition ratio of the first GaN based layer>the second
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventors: SHANG JU TU, YA YU YANG, CHIA CHENG LIU, TSUNG CHENG CHANG
  • Patent number: 10457549
    Abstract: A semiconductive structure includes a first substrate comprising an interconnection layer and a first conductor protruding from the interconnection layer, a second substrate comprising a second conductor bonded with the first conductor, a first cavity between and sealed by the first substrate and the second substrate and the first cavity has a first cavity pressure, a second cavity between and sealed by the first substrate and the second substrate and the second cavity has a second cavity pressure, a first surface of the interconnection layer is a sidewall of the first cavity, wherein the first cavity pressure is less than the second cavity pressure.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: October 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD.
    Inventors: Yen-Cheng Liu, Cheng-Yu Hsieh, Shang-Ying Tsai, Kuei-Sung Chang
  • Patent number: 10361295
    Abstract: A nitride semiconductor epitaxial stack structure including: a Silicon substrate; an aluminum-including nucleation layer disposed on the silicon substrate; a buffer structure disposed on the aluminum-including nucleation layer and sequentially including: a first superlattice epitaxial structure, a first GaN based thick layer disposed on the first superlattice epitaxial structure, a second superlattice epitaxial structure disposed on the first GaN based thick layer, and a second GaN based thick layer disposed on the second superlattice epitaxial structure; a channel layer disposed on the buffer structure; a barrier layer disposed on the channel layer; and a two dimensional electron gas layer disposed near an interface between the channel layer and the barrier layer, wherein the total thickness of the first GaN based thick layer and the second GaN based thick layer is more than 2 micrometers.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: July 23, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Shang Ju Tu, Ya Yu Yang, Chia Cheng Liu, Tsung Cheng Chang
  • Patent number: 8786074
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8786073
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8324722
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: December 4, 2012
    Assignee: Truelight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8121167
    Abstract: A dual wavelength laser device including a cap, a header, a first laser chip and a second laser chip. The cap includes a cap body and a lens embedded on the cap body. The header forms an accommodating space with the cap. The first laser chip is arranged in the accommodating space and emitting a first laser beam toward the lens. The second laser chip is arranged in the accommodating space and emitting a second laser beam toward the lens.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: February 21, 2012
    Assignee: Truelight Corporation
    Inventors: Jin-Shan Pan, Shang-Cheng Liu, Cheng-Ju Wu, Chang-Cherng Wu
  • Publication number: 20110121323
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Application
    Filed: January 14, 2010
    Publication date: May 26, 2011
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Publication number: 20090279898
    Abstract: A bi-directional optical device includes: a TO cap; a TO header defining a receiving space together with the TO cap; a laser chip provided on the TO header and in the receiving space; and a light-receiving chip provided on the TO header and in the receiving space. The TO cap has a cap body and a lens embeddedly mounted on the cap body. The laser chip emits a first laser beam toward the lens. The light-receiving chip faces the lens and receives a second laser beam transmitted through the lens. The laser chip and the light-receiving chip are packaged together within the receiving space defined by the TO cap and the TO header, so as to effectuate a bi-directional optical device for emitting and receiving light of different wavelengths.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 12, 2009
    Inventors: Jin-Shan Pan, Shang-Cheng Liu, Cheng-Ju Wu
  • Publication number: 20090279578
    Abstract: A dual wavelength laser device including a cap, a header, a first laser chip and a second laser chip. The cap includes a cap body and a lens embedded on the cap body. The header forms an accommodating space with the cap. The first laser chip is arranged in the accommodating space and emitting a first laser beam toward the lens. The second laser chip is arranged in the accommodating space and emitting a second laser beam toward the lens.
    Type: Application
    Filed: May 6, 2009
    Publication date: November 12, 2009
    Inventors: Jin-Shan PAN, Shang-Cheng LIU, Cheng-Ju WU, Chang-Cherng WU
  • Publication number: 20090279894
    Abstract: A triple wavelength bidirectional optical communication system includes an optical fiber, a transmitter optical subassembly and a receiver optical subassembly. The transmitter optical subassembly includes a first filter, a dual wavelength laser device and a first detector device. The dual wavelength laser device emits a first and a second laser beam to the optical fiber. The first detector device receives a third laser beam emitted from the optical fiber and propagated via the first filter. The receiver optical subassembly includes a second filter, a transceiver device and a second detector device. The transceiver device emits the third laser beam propagated via the second filter and reached to the optical fiber and also receives the first laser beam emitted from the optical fiber and propagated via the second filter. The second detector device receives the second laser beam emitted from the second facet and propagated via the second filter.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 12, 2009
    Inventors: Jin-Shan Pan, Shang-Cheng Liu, Cheng-Ju Wu