Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: A fabricating method of a non-woven film, for electronic components, includes the following steps. Providing a polyetherimide substrate and an aerogel dispersion, in which the aerogel dispersion includes an aerogel, and the aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%. Dipping the polyetherimine substrate in the aerogel dispersion, such that the aerogel dispersion covers the polyetherimine substrate. Performing a thermal compression process on the polyetherimide substrate, such that the aerogel and the polyetherimide substrate are composited with each other. Performing an ultrasonic oscillating process on the polyetherimine substrate, such that the aerogel not being composited with the polyetherimine substrate is removed.

Abstract: A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: An electronic device may have a display such as an organic light-emitting diode display. The organic light-emitting diode (OLED) display may have an array of organic light-emitting diode pixels that each have OLED layers interposed between a cathode and an anode. A first passivation layer, a first planarization layer, and a second passivation layer may be formed over the cathode. The first and second passivation layers may be formed from inorganic material. A second planarization layer may be formed over the second passivation layer between the second passivation layer and a polarizer. The second planarization layer may planarize the polarizer at the edges of the active area of the display where the polarizer would otherwise have a steep taper. Planarizing the polarizer in this way mitigates undesirable secondary reflections off of the polarizer. The first and second planarization layers may be formed from organic material.

Abstract: A storage apparatus includes a storage device having a first storage assembly with a plurality of first storage racks and a second storage assembly with a plurality of second storage racks surrounding the first storage racks. At least one of the first and second storage assemblies includes a removable carrier rack configured to align with a selected storage rack of the other first or second storage assembly. A protective cover device includes first and second protective cover assemblies respective disposed on top ends of the first and second storage assemblies. At least one of the first and second protective cover assemblies is openable at an area corresponding to the top of the carrier rack to permit removal of the same.

Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels, that include hybrid thin-film transistor structures formed using semiconducting-oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. A drive transistor in the display pixel may be a top-gate semiconducting-oxide thin-film transistor and a switching transistor in the display pixel may be a top-gate silicon thin-film transistor. A storage capacitor in the display may include a conductive semiconducting-oxide electrode.

Abstract: A method for designing an instrument for orthopedic surgery includes obtaining imaging information associated with a bone segment of a subject and an implant fastened to the bone segment, creating a bone segment model and an implant model based on the imaging information associated with the bone segment and the implant, and generating information regarding a shape of an instrument based on the bone segment model and the implant model. The instrument is to be disposed on the bone segment and the implant. The instrument is formed with a path to align a positioning component with a location of the bone segment which is not covered by the implant and at which the positioning component is to engage the bone segment.

Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels, that include hybrid thin-film transistor structures formed using semiconducting-oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. A drive transistor in the display pixel may be a top-gate semiconducting-oxide thin-film transistor and a switching transistor in the display pixel may be a top-gate silicon thin-film transistor. A storage capacitor in the display may include a conductive semiconducting-oxide electrode.

Abstract: Improvement of visual uniformity of an integrated touch screen display is provided. A touch screen can include common electrodes separated by gaps in a Vcom layer. To improve visual non-uniformity in the display resulting from the gaps, a first set of semi-transparent dummy features (primary-dummy features) can be formed on a second layer at the locations of the gaps, and a second set of dummy features (supplementary-dummy features) can also be formed on the second layer or another layer to mitigate low spatial resolution of the primary-dummy features and/or non-uniform spacing of the primary-dummy features. In some examples, holes or slits can be formed in the Vcom layer at areas of the supplementary-dummy features to further improve visual uniformity.

Abstract: A display may have a thin-film transistor layer formed from a layer of thin-film transistor circuitry on a substrate, a color filter layer, and a layer of liquid crystal material interposed between the thin-film transistor layer and the color filter layer. The thin-film transistor layer, the liquid crystal layer, and the color filter layer may be sandwiched between upper and lower polarizers. A backlight unit may supply backlight illumination for pixels in the display. The color filter layer may have a black matrix with an array of openings. Color filter elements of different colors may be formed in the openings. The black matrix may have sidewalls that are steep or that are undercut. The profile of the black matrix helps block improperly colored off-axis light and thereby reduces undesired color mixing in the display.

Abstract: A storage apparatus includes a storage device having a first storage assembly with a plurality of first storage racks and a second storage assembly with a plurality of second storage racks surrounding the first storage racks. At least one of the first and second storage assemblies includes a removable carrier rack configured to align with a selected storage rack of the other first or second storage assembly. A protective cover device includes first and second protective cover assemblies respective disposed on top ends of the first and second storage assemblies. At least one of the first and second protective cover assemblies is openable at an area corresponding to the top of the carrier rack to permit removal of the same.

Abstract: A method is provided for fabricating thin-film transistors (TFTs) for an LCD having an array of pixels. The method includes depositing a first photoresist layer over a portion of a TFT stack. The TFT stack includes a conductive gate layer, and a semiconductor layer. The method also includes doping the exposed semiconductor layer with a first doping dose. The method further includes etching a portion of the conductive gate layer to expose a portion of the semiconductor layer, and doping the exposed portion of the semiconductor layer with a second doping dose. The method also includes removing the first photoresist layer, and depositing a second photoresist layer over a first portion of the doped semiconductor layer in an active area of the pixels to expose a second portion of the doped semiconductor layer in an area surrounding the active area.

Abstract: An OLED module equipped with vertical electric connection structure includes a substrate, a plurality of OLED clusters, an anode wire structure and a cathode wire structure. The substrate is extended toward a first direction. The OLED clusters are located on the substrate in the first direction. The anode wire structure includes a bottom layer wire set, an insulation layer, a middle wire layer set and a top layer wire set. The bottom layer wire set is located on the substrate. The insulation layer is located on the bottom layer wire set. The top layer wire set is located on the insulation layer. The cathode wire structure is located on the substrate and extended axially thereof. The middle layer wire set runs through the insulation layer and forms vertical connection between the bottom layer wire set and the top layer wire set.

Abstract: A display may have upper and lower display layers. A layer of liquid crystal material may be interposed between the upper and lower display layers. The display layers may have substrates. The display layers may include a color filter layer having an array of color filter elements on a glass substrate and a thin-film transistor layer having a layer of thin-film transistor circuitry on a glass substrate. Dielectric layers within the display layers such as dielectric layers within the thin-film transistor layer may have differing indices of refraction. Reflections and color shifts due to index of refraction discontinuities may be minimized by interposing graded index dielectric layers between adjacent layers with different indices. The graded index layers may be formed from structures with a continuously varying index of refraction or structures with a step-wise varying index of refraction.

Abstract: A display may have a layer of liquid crystal material between a color filter layer and a thin-film transistor layer. Column spacer structures may be formed between the color filter layer and the thin-film transistor layer to maintain a desired separation between the color filter and thin-film transistor layers. Column spacers may be deposited in column spacer regions of the color filter layer. The color filter layer may include rows of red, green, and blue color filter elements. Blue color filter material that forms blue color filter elements in the color filter layer may also be used to form a planar surface over red and green color filter elements in the column spacer regions. Using the blue color filter material to planarize the surface on which column spacers are formed ensures that the column spacers provide sufficient support for the display without requiring an additional planarization layer.

Abstract: A display may have upper and lower display layers. A layer of liquid crystal material may be interposed between the upper and lower display layers. The display layers may have substrates. A thin-film transistor layer may have a layer of thin-film transistor structures on a substrate such as a clear glass layer. A planarization layer may be formed on the thin-film transistor structures. A transparent conductive layer may be formed on the planarization layer. The display may have a dielectric layer on the transparent conductive layer. Pixels may be formed in the display layers. The pixels may include pixel electrodes having fingers. The fingers may be formed on the dielectric layer. Trenches in the dielectric layer may be formed between the fingers. The trenches may extend to the transparent conductive layer or may be formed only partway into the dielectric layer.

Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. Organic light-emitting diode display pixels may have combinations of oxide and silicon transistors. In a liquid crystal display, display driver circuitry may include silicon thin-film transistor circuitry and display pixels may be based on oxide thin-film transistors. A single layer or two different layers of gate metal may be used in forming silicon transistor gates and oxide transistor gates. A silicon transistor may have a gate that overlaps a floating gate structure.

Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels, that include hybrid thin-film transistor structures formed using semiconducting-oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. A drive transistor in the display pixel may be a top-gate semiconducting-oxide thin-film transistor and a switching transistor in the display pixel may be a top-gate silicon thin-film transistor. A storage capacitor in the display may include a conductive semiconducting-oxide electrode.