Patents by Inventor Shang-Chun Lin

Shang-Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973037
    Abstract: A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 30, 2024
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 11916035
    Abstract: A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: February 27, 2024
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 5997738
    Abstract: A water saving device for a reverse osmosis water fountain machine is provided in which an aspirating pipe with a solenoid valve is coupled to an intake pipe line at the front end of the reverse osmosis cylinder. Before that joint, another solenoid valve is connected to the intake pipe line. The rear end of the aspirating pipe extends into a reservoir. A solenoid valve is connected to a drain pipe line of the reverse osmosis cylinder, and extends into an input pipe of a reservoir. All of the solenoid valves are controlled by a central processing unit to change the working state of the water purification system. One such operating state is the recycling of the waste water from the reverse osmosis cylinder, thereby reducing the amount of waste water produced.
    Type: Grant
    Filed: March 16, 1998
    Date of Patent: December 7, 1999
    Inventor: Shang-Chun Lin