Patents by Inventor SHANG-FENG HSIEH

SHANG-FENG HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220140173
    Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Inventors: Chi-Chih SHEN, Kuo-Hsiung LI, Shang-Feng HSIEH, Jui-Cheng CHUANG, Yi-Chang CHANG
  • Patent number: 10274365
    Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: April 30, 2019
    Assignee: PIXART IMAGING INC.
    Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang
  • Publication number: 20180087958
    Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).
    Type: Application
    Filed: April 4, 2017
    Publication date: March 29, 2018
    Inventors: CHI-CHIH SHEN, KUO-HSIUNG LI, SHANG-FENG HSIEH, JUI-CHENG CHUANG