Abstract: A method for fabricating lead frames of light emitting diodes (LEDs) including following steps is provided. First, a conductive frame tape is provided. The conductive frame tape includes a plurality of conductive frames arranged along an extending direction of the conductive frame tape. Each of the conductive frames has a first connection portion adapted to carry an LED chip. Next, a plurality of first sputter layers are selectively sputtered onto the conductive frame tape through at least one target, and the first sputter layers are formed on the first connection portions, respectively.

Abstract: An optical sensing device is suitable for detecting information on an information plane. The optical sensing device includes a light source, an optical grating and an optical detector. The light source is suitable for providing a light beam along a first axis. The light beam is illuminated on the information plane and is converted into an optical signal exiting the information plane. The optical grating has at least a split. The optical detector is suitable for receiving the optical signal to generate the information. The optical signal passes through the split of the grating and reaches the optical detector along a second axis that is positioned at an angle with respect to the first axis.