Abstract: In an embodiment, a method of forming a structure includes forming a first transistor and a second transistor over a first substrate; forming a front-side interconnect structure over the first transistor and the second transistor; etching at least a backside of the first substrate to expose the first transistor and the second transistor; forming a first backside via electrically connected to the first transistor; forming a second backside via electrically connected to the second transistor; depositing a dielectric layer over the first backside via and the second backside via; forming a first conductive line in the dielectric layer, the first conductive line being a power rail electrically connected to the first transistor through the first backside via; and forming a second conductive line in the dielectric layer, the second conductive line being a signal line electrically connected to the second transistor through the second backside via.

Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: A light-emitting diode package includes a substrate, at least one light-emitting chip, a light-reflective layer and a wave-length conversion fluorescent layer. The light-emitting chip is located on the substrate. The light-reflective layer is arranged around the light-emitting chip. The wave-length conversion fluorescent layer is located over the light-emitting chip, wherein the light-reflective layer is spaced from the fluorescent wave-length conversion layer by a groove that reaches two opposite sides of the light-emitting diode package.

Abstract: A light-emitting diode package includes a substrate, at least one light-emitting chip, a light-reflective layer and a wave-length conversion fluorescent layer. The light-emitting chip is located on the substrate. The light-reflective layer is arranged around the light-emitting chip. The wave-length conversion fluorescent layer is located over the light-emitting chip, wherein the light-reflective layer is spaced from the fluorescent wave-length conversion layer by a groove that reaches two opposite sides of the light-emitting diode package.

Abstract: The phosphor sheet of the present invention mainly includes a sheet material that is formed by mixing and solidifying of a phosphor powder and an adhesive material. The sheet material subsequently forms a first surface that receives a light source, and forms a second surface that is located on the opposite side to the first surface for scattering a light source. In addition, the distribution ratio of the phosphor powder as well as the adhesive material within the phosphor sheet is based mainly on the different positions and different distances towards the light source; the distribution ratio of the phosphor powder and the adhesive material increases gradually from the first surface towards the second surface. The phosphor of the present invention is designed to be a sheet material, so as to enable the overall volume of the light emitting device to be reduced.

Abstract: The phosphor sheet of the present invention mainly includes a sheet material that is formed by mixing and solidifying of a phosphor powder and an adhesive material. The sheet material subsequently forms a first surface that receives a light source, and forms a second surface that is located on the opposite side to the first surface for scattering a light source. In addition, the distribution ratio of the phosphor powder as well as the adhesive material within the phosphor sheet is based mainly on the different positions and different distances towards the light source; the distribution ratio of the phosphor powder and the adhesive material increases gradually from the first surface towards the second surface. The phosphor of the present invention is designed to be a sheet material, so as to enable the overall volume of the light emitting device to be reduced.

Abstract: An LED light core structure, which has better mechanical strength and good heat dissipation effect and is able to 360-degree project light. The LED light core structure includes a metal-made substrate having at least two faces. The substrate is formed with multiple openings communicating the two faces. At least one lug is connected with an edge of each opening. The lug is bent from one of the faces and extends outward from one of the faces. An LED is disposed on the lug, whereby the light of the LED is projected to one of the faces and the other opposite face through the opening. The substrate is unlikely to crack so that the ratio of good products is increased. The substrate can provide excellent heat dissipation effect for the LED. Due to the openings, the LED light core can project light to both sides of the substrate.

Abstract: A dimmable light-emitted diode (LED) packaging structure is described. The dimmable LED packaging structure employs a plurality of first fluorescent layers respectively positioned on some of a plurality of first types of LED chips to solve the problems of color temperature and light mixing uniformity. Further, a second fluorescent layer overlays the first fluorescent layers and a potion of the first types of LED chips to simplify the manufacturing step of dimmable LED packaging structure.