Patents by Inventor Shang-I Chou

Shang-I Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9412670
    Abstract: A system and method of applying power to a target plasma chamber include, characterizing a no plasma performance slope of the target plasma chamber, applying a selected plasma recipe to a first wafer in the target chamber, the selected plasma recipe includes a selected power set point value and monitoring a recipe factor value on the RF electrode. A ratio of process efficiency is generated comparing the reference chamber and the target chamber, the generating using as inputs the no plasma performance slopes of the target chamber and the reference chamber and the monitored recipe factor value. An adjusted power set point value is calculated, the adjusted power set point configured to cause power delivered to a plasma formed in the target chamber to match power that would be delivered to a reference plasma formed in the reference chamber.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: August 9, 2016
    Assignee: Lam Research Corporation
    Inventors: Robert G. O'Neill, Arthur Sato, Eric Tonnis, Seetharaman Ramachandran, Shang-I Chou
  • Publication number: 20140349417
    Abstract: A system and method of applying power to a target plasma chamber include, characterizing a no plasma performance slope of the target plasma chamber, applying a selected plasma recipe to a first wafer in the target chamber, the selected plasma recipe includes a selected power set point value and monitoring a recipe factor value on the RF electrode. A ratio of process efficiency is generated comparing the reference chamber and the target chamber, the generating using as inputs the no plasma performance slopes of the target chamber and the reference chamber and the monitored recipe factor value. An adjusted power set point value is calculated, the adjusted power set point configured to cause power delivered to a plasma formed in the target chamber to match power that would be delivered to a reference plasma formed in the reference chamber.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: Lam Research Corporation
    Inventors: Robert G. O'Neill, Arthur Sato, Eric Tonnis, Seetharaman Ramachandran, Shang-I Chou
  • Patent number: 8624210
    Abstract: A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventors: Yen-Kun Victor Wang, Shang-I Chou, Jason Autustino
  • Publication number: 20130288488
    Abstract: A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber.
    Type: Application
    Filed: June 21, 2013
    Publication date: October 31, 2013
    Inventors: Yen-Kun Victor Wang, Shang-I Chou, Jason Augustino
  • Patent number: 8525139
    Abstract: A wafer is provided into an entrance load lock chamber. A vacuum is created in the entrance load lock chamber. The wafer is transported to a processing tool. The wafer is processed in a process chamber to provide a processed wafer, wherein the processing forms halogen residue. A degas step is provided in the process chamber after processing the wafer. The processed wafer is transferred into a degas chamber. The processed wafer is treated in the degas chamber with UV light and a flow of gas comprising at least one of ozone, oxygen, or H2O. The flow of gas is stopped. The UV light is stopped. The processed wafer is removed from the degas chamber.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 3, 2013
    Assignee: Lam Research Corporation
    Inventors: Harmeet Singh, Sanket Sant, Shang-I Chou, Vahid Vahedi, Raphael Casaes, Seetharaman Ramachandran
  • Patent number: 8492736
    Abstract: A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: July 23, 2013
    Assignee: Lam Research Corporation
    Inventors: Yen-Kun Victor Wang, Shang-I Chou, Jason Augustino
  • Patent number: 8232538
    Abstract: A method and apparatus for removing halogen residue from a processed wafer is provided. A wafer is transferred into a processing tool where it is processed in a manner that leaves halogen residue on the wafer. The processed wafer is then moved into a degas chamber where it is treated with UV light and a gas mixture containing at least one of ozone and oxygen to remove the halogen residue. Once treated, the wafer is transferred into an isolation station where it is isolated from the unprocessed wafers for a period of time to allow any remaining residue to dissipate before it is returned to the cassette where it started.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: July 31, 2012
    Assignee: Lam Research Corporation
    Inventors: Sanket Sant, Shang-I Chou
  • Publication number: 20110306213
    Abstract: A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber.
    Type: Application
    Filed: June 9, 2010
    Publication date: December 15, 2011
    Applicant: Lam Research Corporation
    Inventors: Yen-Kun Victor Wang, Shang-I Chou, Jason Augustino
  • Patent number: 8060330
    Abstract: A wafer handling mechanism is operated to place a wafer on a chuck. A chucking force is then applied to the wafer, whereby wafer support features of the chuck transfer a defect pattern onto a surface of the wafer. The surface of the wafer is analyzed by a defect metrology tool to obtain a mapping of the defect pattern transferred onto the surface of the wafer. A center coordinate of the chuck within a coordinate system of the wafer is determined by analyzing the defect pattern as transferred to the surface of the wafer. A spatial offset between the center coordinate of the chuck and the center of the wafer is determined. The spatial offset is used to adjust the wafer handling mechanism so as to enable alignment of the center of the wafer to the center coordinate of the chuck.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: November 15, 2011
    Assignee: Lam Research Corporation
    Inventors: Robert Griffith O'Neill, Jorge Luque, Shang-I Chou, Harmeet Singh
  • Publication number: 20110095207
    Abstract: A method and apparatus for removing halogen residue from a processed wafer is provided. A wafer is transferred into a processing tool where it is processed in a manner that leaves halogen residue on the wafer. The processed wafer is then moved into a degas chamber where it is treated with UV light and a gas mixture containing at least one of ozone and oxygen to remove the halogen residue. Once treated, the wafer is transferred into an isolation station where it is isolated from the unprocessed wafers for a period of time to allow any remaining residue to dissipate before it is returned to the cassette where it started.
    Type: Application
    Filed: October 27, 2009
    Publication date: April 28, 2011
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Sanket Sant, Shang-I Chou
  • Publication number: 20110097902
    Abstract: A wafer is provided into an entrance load lock chamber. A vacuum is created in the entrance load lock chamber. The wafer is transported to a processing tool. The wafer is processed in a process chamber to provide a processed wafer, wherein the processing forms halogen residue. A degas step is provided in the process chamber after processing the wafer. The processed wafer is transferred into a degas chamber. The processed wafer is treated in the degas chamber with UV light and a flow of gas comprising at least one of ozone, oxygen, or H2O. The flow of gas is stopped. The UV light is stopped. The processed wafer is removed from the degas chamber.
    Type: Application
    Filed: October 20, 2010
    Publication date: April 28, 2011
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Harmeet Singh, Sanket Sant, Shang-I Chou, Vahid Vahedi, Raphael Casaes, Seetharaman Ramachandran
  • Publication number: 20100150695
    Abstract: A wafer handling mechanism is operated to place a wafer on a chuck. A chucking force is then applied to the wafer, whereby wafer support features of the chuck transfer a defect pattern onto a surface of the wafer. The surface of the wafer is analyzed by a defect metrology tool to obtain a mapping of the defect pattern transferred onto the surface of the wafer. A center coordinate of the chuck within a coordinate system of the wafer is determined by analyzing the defect pattern as transferred to the surface of the wafer. A spatial offset between the center coordinate of the chuck and the center of the wafer is determined. The spatial offset is used to adjust the wafer handling mechanism so as to enable alignment of the center of the wafer to the center coordinate of the chuck.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 17, 2010
    Applicant: Lam Research Corporation
    Inventors: Robert Griffith O'Neill, Jorge Luque, Shang-I Chou, Harmeet Singh