Patents by Inventor Shang In Shin

Shang In Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable-cycle permanent-magnet undulator
    Patent number: 9502166
    Abstract: A variable-period permanent-magnet undulator which is applicable not only to a planar undulator but also to a helical undulator, in which permanent-magnets and ferromagnetic substances are alternately arranged, and the ferromagnetic substance interposed between the permanent-magnets is saturated to thus enable the magnets to be effectively spaced apart from each other by the repulsive force between the permanent-magnets, thereby adjusting the period of the magnetic field in an easy and precise manner.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: November 22, 2016
    Assignee: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Young Uk Jeong, Ki Tae Lee, Seong Hee Park, Shang In Shin, Kyuha Jang, Jeong Ho Moon, Nikolay Vinokurov
  • VARIABLE-CYCLE PERMANENT-MAGNET UNDULATOR
    Publication number: 20150255201
    Abstract: A variable-period permanent-magnet undulator which is applicable not only to a planar undulator but also to a helical undulator, in which permanent-magnets and ferromagnetic substances are alternately arranged, and the ferromagnetic substance interposed between the permanent-magnets is saturated to thus enable the magnets to be effectively spaced apart from each other by the repulsive force between the permanent-magnets, thereby adjusting the period of the magnetic field in an easy and precise manner.
    Type: Application
    Filed: December 26, 2012
    Publication date: September 10, 2015
    Inventors: Young Uk Jeong, Ki Tae Lee, Seong Hee Park, Shang In Shin, Kyuha Jang, Jeong Ho Moon, Nikolay Vinokurov
  • PACKAGE STRUCTURE
    Publication number: 20120126384
    Abstract: The present invention employs tie bar(s) of a lead frame as contact(s) so as to increase the number of contacts in a package structure. Therefore, a die can be packaged in a package structure with a smaller dimension to lower packaging cost of an integrated circuit.
    Type: Application
    Filed: September 14, 2011
    Publication date: May 24, 2012
    Applicant: GREEN SOLUTION TECHNOLOGY CO., LTD.
    Inventor: Shang-Shin MENG