Abstract: A substrate of an optical electrical module is provided. The substrate includes a plurality of accommodating grooves and a reflective groove. The accommodating grooves respectively extend along a first direction. The reflective groove is connected with the accommodating grooves and extends along a second direction perpendicular to the first direction.

Abstract: A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (?+90°*n), wherein ? is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.

Abstract: A silicon photonic integrated system in a switch includes a multi-wavelength laser module, a first multiplexer, an optical channel, and a light signal generating element. The multi-wavelength laser module is configured to emit n laser beams with different peak wavelengths, and n is an integer greater than 2. The first multiplexer is optically coupled to the multi-wavelength laser module and configured to receive the laser beams and combine them into a combined beam. The optical channel is configured to receive a combined beam. The light signal generating element receives the combined beam through the optical channel and modulates the combined beam to emit a plurality of light output signals.

Abstract: A silicon photonic integrated system in a switch includes a multi-wavelength laser module, a first multiplexer, an optical channel, and a light signal generating element. The multi-wavelength laser module is configured to emit n laser beams with different peak wavelengths, and n is an integer greater than 2. The first multiplexer is optically coupled to the multi-wavelength laser module and configured to receive the laser beams and combine them into a combined beam. The optical channel is configured to receive a combined beam. The light signal generating element receives the combined beam through the optical channel and modulates the combined beam to emit a plurality of light output signals.

Abstract: A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (?+90°*n), wherein ? is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.

Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing the reflective surface and faces the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.

Abstract: An optical connection module includes a substrate, an arrayed wavelength grating structure, an optical detector, and an oblique surface. The arrayed wavelength grating structure is disposed on the substrate and the arrayed wavelength grating structure is configured to transmit a light. The optical detector is disposed on the substrate, and the optical detector is configured to detect the light propagating through the arrayed wavelength grating structure. The oblique surface is configured to redirect the light from the arrayed wavelength grating structure to the optical detector.

Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.

Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing the reflective surface and faces the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.

Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.

Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing to the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing to the reflective surface and faces to the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.

Abstract: The invention provides a solar package structure and a method for fabricating the same. A solar package structure includes a carrier wafer. A conductive pattern layer is disposed on the carrier wafer. A solar cell chip array is disposed on the conductive pattern layer, wherein the solar cell chip array electrically connects to the conductive pattern layer. A first spacer dam is disposed on the carrier wafer, surrounding the solar cell chip array. A first optical element array is disposed over the carrier wafer to concentrate sunbeams onto the solar cell chip array, wherein the first optical element array is spaced apart from the carrier wafer by the first spacer dam.