Patents by Inventor Shang Kim

Shang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912920
    Abstract: A quantum dot-polymer composite including a polymer matrix; and core-shell quantum dots dispersed in the polymer matrix, wherein the core-shell quantum dots include a semiconductor nanocrystal core including indium, zinc, and phosphorus and a semiconductor nanocrystal shell disposed on the semiconductor nanocrystal core, the shell including zinc, selenium, and sulfur. The core-shell quantum dots do not include cadmium, the core-shell quantum dots are configured to emit green light, the core-shell quantum dots have a mole ratio of phosphorus to indium of greater than or equal to about 0.75, and the core-shell quantum dots have a mole ratio of zinc to indium of greater than or equal to about 35, and a method of producing the core-shell quantum dots, and a display device including a light emitting element that includes the quantum dot-polymer composite.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taekhoon Kim, Nayoun Won, Tae Gon Kim, Mi Hye Lim, Shin Ae Jun, Shang Hyeun Park
  • Publication number: 20070120163
    Abstract: A CMOS image sensor and a method for fabricating the same is disclosed, to enhance the image-sensing efficiency by forming a concave lens area for improving the light-condensing efficiency in a planarization layer formed before a micro-lens array, in which the CMOS image sensor includes a plurality of photosensitive devices on a semiconductor substrate; an insulating interlayer on the plurality of photosensitive devices; a plurality of color filter layers in correspondence with the respective photosensitive devices, to filter the light by respective wavelengths; a planarization layer on the color filter layers, and having first micro-lens by intaglio in correspondence with the respective photosensitive patterns to condense the light secondly; and a plurality of second micro-lens layers on the planarization layer in correspondence with the respective photosensitive devices, to condense the light firstly.
    Type: Application
    Filed: December 20, 2006
    Publication date: May 31, 2007
    Inventor: Shang Kim
  • Publication number: 20060138498
    Abstract: Disclosed are a CMOS image sensor capable of improving the focusing capability of light and a method for manufacturing the same. The CMOS image sensor includes a plurality of first micro-lenses formed in the upper part of the planarization layer, each of the first micro-lenses arranged over a corresponding photodiode, and a plurality of second micro-lenses formed on the planarization layer, each of the plurality of second micro-lenses wrapping a corresponding first micro-lens respectively.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 29, 2006
    Applicant: DongbuAnam Semiconductor Inc.
    Inventor: Shang Kim
  • Publication number: 20060033131
    Abstract: A CMOS image sensor and a method for fabricating the same is disclosed, to enhance the image-sensing efficiency by forming a concave lens area for improving the light-condensing efficiency in a planarization layer formed before a micro-lens array, in which the CMOS image sensor includes a plurality of photosensitive devices on a semiconductor substrate; an insulating interlayer on the plurality of photosensitive devices; a plurality of color filter layers in correspondence with the respective photosensitive devices, to filter the light by respective wavelengths; a planarization layer on the color filter layers, and having first micro-lens by intaglio in correspondence with the respective photosensitive patterns to condense the light secondly; and a plurality of second micro-lens layers on the planarization layer in correspondence with the respective photosensitive devices, to condense the light firstly.
    Type: Application
    Filed: December 28, 2004
    Publication date: February 16, 2006
    Inventor: Shang Kim
  • Publication number: 20060011932
    Abstract: A CMOS image sensor and a method for fabricating the same is disclosed, to enhance the efficiency in condensing the light by forming a multi-layered micro lens with various materials having different refractive indexes, in which the CMOS image sensor includes a plurality of photosensitive devices on a semiconductor substrate; an insulating interlayer on the plurality of photosensitive devices; a plurality of color filter layers in correspondence with the respective photosensitive devices, to filter the light by respective wavelengths; a first micro-lens layer on an entire surface of the color filter layers, to condense the light; and a plurality of second micro-lens layers on the first micro-lens layer in correspondence with the respective photosensitive devices, wherein the second micro-lens layer has the different refractive index from that of the first micro-lens layer.
    Type: Application
    Filed: December 28, 2004
    Publication date: January 19, 2006
    Inventor: Shang Kim
  • Publication number: 20050266240
    Abstract: Provided are the high tensile nonmagnetic stainless steel wire for an low loss overhead electric conductor, the low loss overhead electric conductor using the high tensile nonmagnetic stainless steel wire as its core, and a manufacturing method of them respectively. The high tensile nonmagnetic stainless steel wire reduces a core loss and eddy current loss and minimizes effective electric resistance of the conductor by using the nonmagnetic stainless steel wire, that is a non-magnetic material, rather than a high carbon steel wire, that is a strong magnetic material. In addition, an overall power transmission loss is minimized by strengthening the tensile strength of and reducing a sectional area of the steel wire, making an aluminium-welded layer thicker, and increasing the sectional area of an aluminium conductor.
    Type: Application
    Filed: May 25, 2004
    Publication date: December 1, 2005
    Inventors: Byung Kim, Shang Kim, Byung Woo, Hee Lee, Ju Park, Yong Jeong, Min Lee, Sun Ahn