Patents by Inventor Shang-Kung Tsai

Shang-Kung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar display module
    Patent number: 7525628
    Abstract: A display module includes components of a display panel having an outward first FPC for connecting to a system, wherein the first FPC has a foldable part on which a welding area is defined, and a backlight unit opposite to the display panel for providing illumination for the display panel. The backlight unit has an outward second FPC which is welded with the welding area of the foldable part. Both the foldable part and second FPC are folded and turned around to keep the welding area attach to the backside of the backlight unit.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: April 28, 2009
    Assignee: AU Optronics Corp.
    Inventors: Chia-Jung Wu, Wen-Hui Peng, Che-Chih Chang, Shang-Kung Tsai, Yu-Meng Kao, Chih-Hao Chang
  • Metal bump with an insulating sidewall and method of fabricating thereof
    Patent number: 7041589
    Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: May 9, 2006
    Assignee: AU Optronics Corp.
    Inventors: Ming-Yi Lay, Yong-Fen Hsieh, Shang-Kung Tsai, Chin-Kun Lo
  • Metal bump with an insulating sidewall and method of fabricating thereof
    Patent number: 6958539
    Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: October 25, 2005
    Assignee: Au Optronics Corporation
    Inventors: Ming-Yi Lay, Yong-Fen Hsieh, Shang-Kung Tsai, Chin-Kun Lo
  • SYMMETRICAL LIQUID CRYSTAL DISPLAY PANEL
    Publication number: 20040174488
    Abstract: A symmetrical LCD panel has a substrate, at least a source driver IC positioned on a central part of a peripheral area of the substrate, a flexible circuit board positioned on the same side as the source driver IC of the substrate, at least a gate driver IC positioned on a central part of the flexible circuit board, and a plurality of conductive wires connected to the gate driver IC, the source driver IC, and a display area of the substrate.
    Type: Application
    Filed: October 21, 2003
    Publication date: September 9, 2004
    Inventor: Shang-Kung Tsai
  • Metal bump with an insulating sidewall and method of fabricating thereof
    Publication number: 20040048202
    Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
    Type: Application
    Filed: September 8, 2003
    Publication date: March 11, 2004
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Ming-Yi Lay, Yong-Fen Hsieh, Shang-Kung Tsai, Chin-Kun Lo
  • Metal bump with an insulating sidewall and method of fabricating thereof
    Publication number: 20020048924
    Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
    Type: Application
    Filed: January 19, 2001
    Publication date: April 25, 2002
    Inventors: Ming-Yi Lay, Yong-Fen Hsieh, Shang-Kung Tsai, Chin-Kun Lo