Abstract: A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.

Abstract: The present disclosure provides a bolometer including a substrate, a reflecting mirror on the substrate, and a temperature sensing unit above the reflecting mirror. The temperature sensing unit includes a first insulating layer, a thermistor on the first insulating layer, a second insulating layer on the thermistor, an electrode layer in the second insulating layer and right above the thermistor, and a metal meta-surface in the second insulating layer and right above the electrode layer. The electrode layer includes a plurality of electrodes separated from each other. A projection region of the metal meta-surface on the thermistor is equal to or larger than the thermistor.

Abstract: An infrared sensor includes a substrate, an active pixel array, a reference pixel array, a light absorbing layer, a sidewall spacer, and a shading layer. The active pixel array is over the substrate. The reference pixel is over the substrate, adjacent to the active pixel array, and having a reference pixel. The reference pixel includes a platform, a resistor, and an infrared sensing material layer. The resistor is on the platform. The infrared sensing material layer is over the resistor. The light absorbing layer is over the reference pixel. The sidewall spacer is over the reference pixel and extends along a sidewall of the light absorbing layer. The shading layer is conformally formed over the light absorbing layer and the sidewall spacer.

Abstract: A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.

Abstract: A solar cell includes a solar cell body, a plurality of busbars and a plurality of finger electrodes. The number of the finger electrodes is adjusted according to a width of the finger electrodes, a gap between the finger electrodes and a laid length of the solar cell body, such that a photovoltaic conversion efficiency of the solar cell can be substantially enhanced.

Abstract: A solar cell includes a photovoltaic substrate having a first surface and a second surface and a plurality of bus bar electrode net structures. The bus bar electrode net structures are separately disposed on the first surface, each bus bar electrode net structure includes a bus bar electrode, a plurality of finger electrodes, at least one connecting line electrode and at least one vertical finger electrode. The bus bar electrode is disposed on the first surface. The finger electrodes are separately disposed at two sides of the bus bar electrode. The connecting line electrode is disposed on the first surface. Each connecting line electrode connects with ends of at least two finger electrodes. The vertical finger electrode is disposed on the first surface, and is parallel to the bus bar electrode and disposed between the two ends of the finger electrode to connect with at least two adjacent finger electrodes.

Abstract: A solar cell includes a silicon semiconductor substrate, a composite multifunctional protective film, a plurality of front electrodes and a plurality of back electrodes. The silicon semiconductor substrate has a roughened first surface. A depth of the doped layer arranged under the first surface ranges from 200 nm to 1000 nm. A surface doping concentration of the doped layer ranges from 1×1019 to 5×1020 atoms/cm3. The composite multifunctional protective film is disposed above the doped layer. The composite multifunctional protective film has a plurality of layers, so as to reduce reflectance of incident light. A layer thickness of a layer closest to the doped layer among these layers is less than 40 nm. The plurality of front electrodes penetrates the composite multifunctional protective film and is disposed on the doped layer. The plurality of back electrodes is disposed on a second surface of the silicon semiconductor substrate.