Abstract: A package structure, including a redistribution circuit layer, a first die, a dielectric body, a first connection circuit, a patterned insulating layer, a second die and a third die, is provided. The first die is disposed on the redistribution circuit layer and is electrically connected to the redistribution circuit layer. The dielectric body is disposed on the redistribution circuit layer and covers the first die. The first connection circuit is disposed on the dielectric body and is electrically connected to the redistribution circuit layer. The patterned insulating layer covers the first connection circuit. A portion of the patterned insulating layer is embedded in the dielectric body. The second die is disposed on the dielectric body and is electrically connected to the first connection circuit. The third die is disposed on the redistribution circuit layer, is opposite to the first die, and is electrically connected to the redistribution circuit layer.

Abstract: An optical member driving mechanism for driving an optical member having an optical axis is provided, including a fixed portion, a movable portion, a first elastic member, and a driving assembly. The movable portion is configured to hold the optical member, and is movably connected the fixed portion via the first elastic member. The driving assembly drives the movable portion to move along the optical axis within a range of motion. The range of motion includes a first limit moving range and a second limit moving range. The first limit moving range is the maximum distance that the movable portion can move toward the light-entering side, and the second limit moving range is the maximum distance that the movable portion can move toward the light-emitting side. When the movable portion is in a predetermined position, the first limit moving range is greater than the second limit moving range.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a movable portion, a fixed portion, a driving assembly and a guiding assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The guiding assembly is configured to limit the mode of movement for the movable portion relative to the fixed portion. The guiding assembly includes an intermediate element, the intermediate element contacts the fixed portion and is movable relative to the fixed portion. The guiding assembly further includes a first metallic element, the first metallic element includes metal and corresponds to the intermediate element.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: The disclosure provides a package structure including a redistribution circuit structure, a first circuit board, a second circuit board, a first insulator, multiple conductive terminals, and a package. The redistribution circuit structure has a first connection surface and a second connection surface opposite to each other. The first circuit board and the second circuit board are disposed on the first connection surface and are connected electrically to the redistribution circuit structure. The first insulator is disposed on the first connection surface and covers the first circuit board and the second circuit board. The conductive terminals are connected electrically to and disposed on the first circuit board or the second circuit board. The package is disposed on the second connection surface and is connected electrically to the redistribution circuit structure. A manufacturing method of a package structure is also provided.

Abstract: A package structure including a redistribution circuit structure, an insulator, a plurality of conductive connection pieces, a first chip, a second chip, an encapsulant, a third chip, and a plurality of conductive terminals is provided. The redistribution circuit structure has first and second connection surfaces opposite to each other. The insulator is embedded in and penetrates the redistribution circuit structure. The conductive connection pieces penetrate the insulator. The first and second chips are disposed on the first connection surface. The encapsulant is disposed on the redistribution circuit structure and at least laterally covers the first and second chips. The third chip is disposed on the second connection surface and electrically connected to the first and second chips through the conductive connection pieces. The conductive terminals are disposed on the second connection surface and electrically connected to the first chip or the second chip through the redistribution circuit structure.

Abstract: A dynamic antenna tuning system. The dynamic antenna tuning system includes: an antenna controller; and, a tunable antenna, the tunable antenna comprising a plurality of switches, the switches being controlled by the antenna controller to dynamically configure the antenna in one of a plurality of antenna geometry configurations.

Abstract: An integrated antenna package structure including a chip, a circuit layer, an encapsulant, a coupling end, an insulating layer, a conductive connector, a dielectric substrate, and an antenna is provided. The circuit layer is electrically connected to the chip. The encapsulant is disposed on the circuit layer and covers the chip. The coupling end is disposed on the encapsulant. The insulating layer covers the coupling end. The insulating layer is not externally exposed. The conductive connector penetrates the encapsulant. The coupling end is electrically connected to the circuit layer by the conductive connection. The dielectric substrate is disposed on the encapsulant and covers the coupling end. The antenna is disposed on the dielectric substrate. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: An optical element driving module is provided, including a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting an optical element. The fixed portion is movably connected to the movable portion, wherein the fixed portion includes a base and a casing. The casing is arranged with the base along a main axis, the casing includes a top wall and a side wall extended from edges of the top wall along the main axis, and the top wall includes a first surface facing the movable portion, a second surface and a third surface facing away from the first surface. The driving assembly is used for moving the movable portion relative to the fixed portion, a minimum distance between the first surface and the second surface is different from a minimum distance between the second surface and the third surface.

Abstract: A camera shutter for exposing or shielding a camera including a supporting portion, a winding assembly, a movable cover, and a magnet is provided. The winding assembly is capable of driving the magnet to move the movable cover along a first direction while a first current passes through the winding assembly to form a first magnetic field, and to make the shielding side of the movable cover shield the camera. The winding assembly is also capable of driving the magnet to move the movable cover along a second direction while a second current passes through the winding assembly to form a second magnetic field, and to make the shielding side of the movable cover away from the camera to expose the camera.

Abstract: The present disclosure provides a camera device with optical image stabilization, comprising: a base, a first carrying member, a camera module, a first optical compensating component, a second optical compensating component, and a guiding component. The first carrying member is slidably assembled to the base. The second carrying member is movably assembled to the first carrying member. The first force interaction member and the second force interaction member are configured to be force-interacted. The second optical compensating component comprises a third force interaction member disposed on the base and a fourth force interaction member disposed on the first carrying member. The guiding component is connected with the base and the first carrying member. The third force interaction member and the fourth force interaction member are configured to be force-interacted.

Abstract: A camera device with image compensation and autofocus function, comprising a first carrying member, a second carrying member, a camera module, a first optical compensation component, a third carrying member, and an autofocus component. The second carrying member is movably assembled to the first carrying member. The first optical compensation component comprises a first force interaction member disposed at the first carrying member and a second force interaction member disposed at the second carrying member, which generate force interaction, allowing the second carrying member to move in the direction of a first axis or/and a second axis intersecting with an optical axis of the optical lens for optical compensation for the optical lens. The third carrying member bears the optical lens and is movably disposed on the second carrying member. The third carrying member could move along an optical axis of the optical lens.

Abstract: An image compensation device and a prism carrying mechanism thereof. The prism carrying mechanism comprises a base and a pair of prism carrying members. The base comprises a base body, a light passing hole disposed at the base body, and a plurality of first sliding assembling parts integrally formed on the same side of the base body. Each of the prism carrying members comprises a carrying member body, a prism assembling part disposed at the carrying member body and corresponding to the light passing hole, and a plurality of second sliding assembling parts integrally formed on the same side of the carrying member body. The prism assembling parts of the pair of prism carrying members are oppositely and alternately disposed in an axial direction. The plurality of second sliding assembling parts are slidably assembled to the plurality of first sliding assembling parts respectively.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a movable portion, a fixed portion, a driving assembly and a guiding assembly. The movable portion is connected to an optical member, and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The guiding assembly limits the mode of movement for the movable portion relative to the fixed portion.

Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.

Abstract: A fan-out semiconductor package includes: a redistribution structure; a functional chip coupled to the redistribution structure; an isolation structure disposed on the redistribution structure and including a body formed with through-holes; a shielding structure disposed on the isolation structure and the redistribution structure; a first conductive pattern structure disposed on the isolation structure and extending through the through-holes of the isolation structure; an encapsulating structure disposed on the isolation structure, the shielding structure and the first conductive pattern structure; and a second conductive pattern structure disposed on the encapsulating structure. A method for manufacturing the fan-out semiconductor package is also disclosed.

Abstract: A package structure, including a redistribution circuit layer, a first die, a dielectric body, a first connection circuit, a patterned insulating layer, a second die and a third die, is provided. The first die is disposed on the redistribution circuit layer and is electrically connected to the redistribution circuit layer. The dielaectric body is disposed on the redistribution circuit layer and covers the first die. The first connection circuit is disposed on the dielectric body and is electrically connected to the redistribution circuit layer. The patterned insulating layer covers the first connection circuit. A portion of the patterned insulating layer is embedded in the dielectric body. The second die is disposed on the dielectric body and is electrically connected to the first connection circuit. The third die is disposed on the redistribution circuit layer, is opposite to the first die, and is electrically connected to the redistribution circuit layer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor package structure, including a circuit substrate, at least two chips, an encapsulant, and a redistribution layer, is provided. The circuit substrate has a first surface and a second surface opposite to the first surface. The at least two chips are disposed on the first surface. Each of the at least two chips has an active surface facing the circuit substrate and includes multiple first conductive connectors and multiple second conductive connectors disposed on the active surface. A pitch of the first conductive connectors is less than a pitch of the second conductive connectors. The encapsulant encapsulates the at least two chips. The redistribution layer is located on the second surface. The first conductive connectors are electrically connected to the redistribution layer by the circuit substrate. The second conductive connectors are electrically connected to the circuit substrate. A manufacturing method of a semiconductor package structure is also provided.

Abstract: A semiconductor package and fabricating method thereof are disclosed. The semiconductor package has a chip, a plurality of first and second bumps, an encapsulation, a redistribution. The chip has a plurality of pads and an active area and the active surface has a first area and a second area surrounding the first area. The pads are formed on a first area of the active surface. Each first bump is formed on the corresponding pad. The second bumps are formed on the second area and each second bump has a first layer and a second layer with different widths. The encapsulation encapsulates the chip and the first and second bumps and is ground to expose the first and second bumps therefrom. During grinding, all of the first bumps are completely exposed by determining a width of an exposed surface of the second bump to electrically connect to the redistribution is increased.