Patents by Inventor Shang Yu Liu

Shang Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230237228
    Abstract: A method of extracting parasitic parameters of a 3D IC is provided in the present invention, including steps of providing a 3D IC having multiple dies, merging respective layouts of the multiple dies into a common layout, creating a common LVS file and a common LPE file for those multiple dies based on the common layout, creating respective LVS files and respective LPE files for every die based on the respective layouts, creating a common netlist from the common LVS file and common LPE file, creating corresponding respective netlists from the respective LVS files and respective LPE files, merging the common netlist and respective netlists into a netlist, and extracting common parasitic parameters of the dies from the netlist.
    Type: Application
    Filed: March 10, 2022
    Publication date: July 27, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Yueh Lin, Chun-Yi Lin, Shang-Yu Liu, Jie-Ru Bai
  • Patent number: 10897112
    Abstract: An AC power cord assembly comprises a cable and a control device, wherein the cable includes at least one first wire for transmitting AC voltages and at least one second wire for transmitting visible lights, wherein the control device includes at least one first LED for emitting visible lights to the at least one second wire.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 19, 2021
    Assignee: BKS TEC CORP.
    Inventors: Cheng Hsiang Chen, Shang Yu Liu