Patents by Inventor Shang-Yung Hou

Shang-Yung Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding pad structure
    Patent number: 7233075
    Abstract: A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: June 19, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chi Hung, Shang-Yung Hou, Shin-Puu Jeng
  • Bonding pad structure
    Publication number: 20060131759
    Abstract: A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
    Type: Application
    Filed: February 15, 2006
    Publication date: June 22, 2006
    Inventors: Meng-Chi Hung, Shang-Yung Hou, Shin-Puu Jeng
  • Bonding pad structure
    Patent number: 7057296
    Abstract: A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: June 6, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chi Hung, Shang-Yung Hou, Shin-Puu Jeng
  • Bonding pad structure
    Publication number: 20050093176
    Abstract: A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Inventors: Meng-Chi Hung, Shang-Yung Hou, Shin-Puu Jeng