Patents by Inventor Shangbin FAN

Shangbin FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12217886
    Abstract: A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable, so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: February 4, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shangbin Fan, Pengwei Ma, Chao Chen, Tao Gong, Hongli Wang
  • Publication number: 20230076232
    Abstract: A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable ,so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 9, 2023
    Inventors: Shangbin FAN, Pengwei MA, Chao CHEN, Tao GONG, Hongli WANG