Patents by Inventor SHANGLU LIN

SHANGLU LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10900225
    Abstract: Some embodiments of the disclosure provide a bamboo building curtain wall plate. According to an embodiment, the bamboo building curtain wall plate include a bamboo substrate, a metal connecting member, and a weather-resistant outer-decorative coating layer. The metal connecting member is disposed on the back surface of the bamboo substrate and connectable to the main body of a building. The weather-resistant outer-decorative coating layer is disposed on the front surface of the bamboo substrate. According to another embodiment, the bamboo substrate includes an outer layer which is a wood veneer or a bamboo material, and a core layer which is a bamboo material. According to a further embodiment, the bamboo substrate has a thickness of 8-15 mm.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: January 26, 2021
    Assignee: Fujian Heqizu Forestry Science and Technology Co., Ltd.
    Inventors: Xianlu Yu, Zheng Wang, Yan Yu, Huanggui Wu, Weihong Xiao, Shanglu Lin
  • Publication number: 20200208401
    Abstract: Some embodiments of the disclosure provide a bamboo building curtain wall plate. According to an embodiment, the bamboo building curtain wall plate include a bamboo substrate, a metal connecting member, and a weather-resistant outer-decorative coating layer. The metal connecting member is disposed on the back surface of the bamboo substrate and connectable to the main body of a building. The weather-resistant outer-decorative coating layer is disposed on the front surface of the bamboo substrate. According to another embodiment, the bamboo substrate includes an outer layer which is a wood veneer or a bamboo material, and a core layer which is a bamboo material. According to a further embodiment, the bamboo substrate has a thickness of 8-15 mm.
    Type: Application
    Filed: July 19, 2019
    Publication date: July 2, 2020
    Inventors: XIANLU YU, ZHENG WANG, YAN YU, HUANGGUI WU, WEIHONG XIAO, SHANGLU LIN