Abstract: A cooling device including a core with a plurality of twin fins connected with a plurality of grooves on the core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the core. The core can be made from a high thermal conductivity material such as copper (Cu) or graphite so that heat conducted from a component in thermal communication with the core can be conducted upward into the core and spread out through the twin fins thereby reducing heat flux concentration. Heat dissipation from the core can be increased by increasing the number of grooves and twin fins, by increasing an area of the twin fins, and by reducing a thermal resistance of a means for connecting the root of the twin fins with the grooves.

Abstract: A cooling device including a split-core with a plurality of twin fins connected with a plurality of grooves on the split-core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the split-core. A heat spreader is in contact with a top portion of the vanes and a heat pipe is connected with the heat spreader and the split-core. A heat concentration in the split-core is dissipated by a thermal path through the heat pipes to the heat spreader and into the vanes and also by a path upward into the split-core and into the vanes via the roots of the twin fins.

Abstract: A cooling system for dissipating heat from a component is disclosed. The cooling system includes a cooling device that includes a core and a plurality of spaced apart fins connected with the core with each fin including at least two vanes. A trailing edge of the fins define a chamber. A fan mount is connected with the vanes and supports a stator of a fan. A rotor connected with the stator includes a plurality of fan blades and the fan mount positions the stator over the chamber with the fan blades submerged in the chamber. A height of the cooling system is reduced because the fan does not include a housing and a substantial portion of the fan is positioned in the chamber. The submerged position of the fan blades allows for a high fan capacity with reduce air shock noise.

Abstract: A cooling device including a split-core with a plurality of twin fins connected with a plurality of grooves on the split-core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the split-core. A heat spreader is in contact with a top portion of the vanes and a heat pipe is connected with the heat spreader and the split-core. A heat concentration in the split-core is dissipated by a thermal path through the heat pipes to the heat spreader and into the vanes and also by a path upward into the split-core and into the vanes via the roots of the twin fins.

Abstract: A cooling system for dissipating heat from a component is disclosed. The cooling system includes a cooling device that includes a core and a plurality of spaced apart fins connected with the core with each fin including at least two vanes. A trailing edge of the fins define a chamber. A fan mount is connected with the vanes and supports a stator of a fan. A rotor connected with the stator includes a plurality of fan blades and the fan mount positions the stator over the chamber with the fan blades submerged in the chamber. A height of the cooling system is reduced because the fan does not include a housing and a substantial portion of the fan is positioned in the chamber. The submerged position of the fan blades allows for a high fan capacity with reduce air shock noise.

Abstract: A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core includes a cavity with a liquid therein. A heat pipe is connected with the liquid chamber and with the core and the heat pipe is in contact with the liquid in the reservoir and the liquid in the cavity so that waste heat in the liquid chamber is thermally communicated to the core and is dissipated by an air flow over the twin fins and the core.

Abstract: A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core includes a cavity with a liquid therein. A heat pipe is connected with the liquid chamber and with the core and the heat pipe is in contact with the liquid in the reservoir and the liquid in the cavity so that waste heat in the liquid chamber is thermally communicated to the core and is dissipated by an air flow over the twin fins and the core.

Abstract: A cooling device including a core with a plurality of twin fins connected with a plurality of grooves on the core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the core. The core can be made from a high thermal conductivity material such as copper (Cu) or graphite so that heat conducted from a component in thermal communication with the core can be conducted upward into the core and spread out through the twin fins thereby reducing heat flux concentration. Heat dissipation from the core can be increased by increasing the number of grooves and twin fins, by increasing an area of the twin fins, and by reducing a thermal resistance of a means for connecting the root of the twin fins with the grooves.

Abstract: A side flow cooling device is disclosed. The side flow cooling device includes a heat mass with arms extending therefrom and a mounting surface for connecting the heat mass with a component to be cooled. The heat mass and the arms include a plurality of fins extending outward therefrom and aligned with a vertical axis of the heat mass. The fins have cooling surfaces and a slot between adjacent fins that are aligned with a longitudinal axis of the heat mass. A fan or the like can be connected with a side face of the cooling device to generate an air flow that is substantially along the longitudinal axis. The air flow wets over the cooling surfaces of the fins, on exposed portions of the heat mass, and on exposed portions of the arms to dissipate heat from the heat mass. The heat mass is not covered by the fan and therefore the fins can populate a substantial portion of a surface area of the heat mass thereby increasing the surface area available for cooling.

Abstract: A low-cost, fan assisting cooling device is disclosed and includes a heat mass, a thermal core, a vapor chamber, and a phase change liquid sealed in the vapor chamber at a low pressure. Waste heat in the thermal core boils the phase change liquid and converts it into a vapor that rises to contact surfaces of the vapor chamber where it is cooled down and converted back into the phase change liquid. A plurality of vanes and fins are connected with the heat mass and an air flow over the vanes and fins dissipates heat from the heat mass. Consequently, the heat mass is convection cooled by the air flow and evaporatively cooled by the boiling of the phase change liquid.

Abstract: A low-cost, fan assisted cooling device is disclosed. The cooling device includes a heat mass with a taper bore therein adapted to receive a heat spreader that has a shape that complement the taper bore. The heat mass and the heat spreader are made from dissimilar materials. A fastener or the like can be used to urge the heat spreader and the mass into contact with each other. A plurality of vanes are connected with the heat mass and an inside surface of the vanes define a chamber that surrounds the heat mass. A portion of each vane is split into a plurality of fins and both the vanes and the fins have a surface area that increase in a radially outward direction from the axis of the heat mass.

Abstract: An attachment mechanism for connecting a cooling device with a component to be cooled and carried by a connector is disclosed. The attachment mechanism includes a plate, a bore that connects with a portion of the cooling device, a hinge that can be removably hinged on the connector, and a latch assembly that includes tilt relief profiles that allow the latch assembly to pivot on the plate so that a latch profile on the latch assembly can be removably latched on the connector. The latch assembly further includes a spring locator and a spring that are positioned within a slot in the latch assembly and hold the spring pre-loaded in compression. When the latch assembly is tilted on the plate, the latch profile is pivoted outward to facilitate latching onto the connector. After latching onto the connector, the spring is further compressed and exerts a load between the cooling device and the component to be cooled such that contact resistance is reduced and thermal transfer is increased.

Abstract: A side flow cooling device is disclosed. The side flow cooling device includes a heat mass with arms extending therefrom and a mounting surface for connecting the heat mass with a component to be cooled. The heat mass and the arms include a plurality of fins extending outward therefrom and aligned with a vertical axis of the heat mass. The fins have cooling surfaces and a slot between adjacent fins that are aligned with a longitudinal axis of the heat mass. A fan or the like can be connected with a side face of the cooling device to generate an air flow that is substantially along the longitudinal axis. The air flow wets over the cooling surfaces of the fins, on exposed portions of the heat mass, and on exposed portions of the arms to dissipate heat from the heat mass. The heat mass is not covered by the fan and therefore the fins can populate a substantial portion of a surface area of the heat mass thereby increasing the surface area available for cooling.

Abstract: A passive cooling device for removing waste heat from a component is disclosed. The passive cooling device includes a heat mass and a stem extending outward therefrom and including a plurality of fins formed in the stem. The stem includes a plurality of stem fins with stem slots therebetween. A plurality of vanes that include fins formed therein surround the stem and define a chamber. A duct connects with a top face of the vanes and an air flow source that generates an air flow through the chamber, the stem fins, the fins, and the vanes to dissipate heat from the heat mass. The air flow source can supply a positive or a negative air flow.

Abstract: An arrayed fin cooling system for removing waste heat from a component is disclosed. The arrayed fin cooling system includes plurality of discrete cooling fins that act as individual heat sinks. The cooling fins are arranged in a radial array so that the cooling fins diverge from one another to define an air path between adjacent cooling fins. Each cooling fin includes a base that is adapted to connect with a surface of the component to be cooled. Waste heat is transferred from the component to the cooling fin via the base. The cooling fins are surrounded at an outer edge by a radial shield that channels an air flow over the cooling fins to maximize the amount of air that passes over the cooling fins. The cooling fins can be manufactured at a low cost using processes such as stamping and forging.

Abstract: An attachment mechanism for connecting a cooling device with a component to be cooled and carried by a connector is disclosed. The attachment mechanism includes a plate, a bore that connects with a portion of the cooling device, a hinge that can be removably hinged on the connector, and a latch assembly that includes tilt relief profiles that allow the latch assembly to pivot on the plate so that a latch profile on the latch assembly can be removably latched on the connector. The latch assembly further includes a spring locator and a spring that are positioned within a slot in the latch assembly and hold the spring pre-loaded in compression. When the latch assembly is tilted on the plate, the latch profile is pivoted outward to facilitate latching onto the connector. After latching onto the connector, the spring is further compressed and exerts a load between the cooling device and the component to be cooled such that contact resistance is reduced and thermal transfer is increased.

Abstract: An arrayed fin cooling system for removing waste heat from a component is disclosed. The arrayed fin cooling system includes plurality of discrete cooling fins that act as individual heat sinks. The cooling fins are arranged in a radial array so that the cooling fins diverge from one another to define an air path between adjacent cooling fins. Each cooling fin includes a base that is adapted to connect with a surface of the component to be cooled. Waste heat is transferred from the component to the cooling fin via the base. The cooling fins are surrounded at an outer edge by a radial shield that channels an air flow over the cooling fins to maximize the amount of air that passes over the cooling fins. The cooling fins can be manufactured at a low cost using processes such as stamping and forging.

Abstract: A retainer assembly for retaining a fastener that includes a shank having a recessed portion therein is disclosed. The retainer assembly includes an inner wall that is inset from and outer wall and is symmetrically positioned about an axis defining a chamber through the retainer body. The chamber includes opposed entrance and exit apertures. The inside wall includes a first inside diameter that extends from the entrance aperture in a direction along the axis and narrowing to a second inside diameter at a slip-over profile, and the inner wall narrowing again to a third inside diameter at an annular ring that extends to the exit aperture. The fastener is inserted through the entrance aperture until the shank engages and then slips over the slip-over profile and through the annular ring so that the recessed portion of the shank is captured within the annular ring.