Abstract: A semiconductor device package includes a first substrate extending along a first central plane, and a second substrate electrically connected to the first substrate and extending along a second central plane that is substantially parallel with and offset from the first central plane of the first substrate. One or more capacitors are electrically and mechanically connected to the second substrate via one or more leads. All of the one or more capacitors are positioned at the second substrate. All of the capacitors being positioned at the second substrate, reduces the complexity of and time required to manufacture the semiconductor device package.

Abstract: A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly’s PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.

Abstract: A variable pitch clamshell hinge for use with clamshell housings includes a first shaft coupled to a first variable diameter device and a second shaft coupled to a second variable diameter device. The first variable diameter device and the second variable diameter device are coupled together using an inelastic linking element. As the shafts are rotated in a first direction the variable diameter devices increase in diameter. As the shafts are rotated in a second direction that is opposite the first direction, the variable diameter devices decrease in diameter. As the variable diameter devices increase in diameter, the inelastic linking element exerts a compressive force on the variable diameter devices, decreasing the distance (i.e., the pitch) between the shafts. As the variable diameter devices decrease in diameter, the inelastic linking element relaxes the compressive force on the variable diameter devices, increasing the distance between the shafts.

Abstract: A variable pitch clamshell hinge for use with clamshell housings includes a first shaft coupled to a first variable diameter device and a second shaft coupled to a second variable diameter device. The first variable diameter device and the second variable diameter device are coupled together using an inelastic linking element. As the shafts are rotated in a first direction the variable diameter devices increase in diameter. As the shafts are rotated in a second direction that is opposite the first direction, the variable diameter devices decrease in diameter. As the variable diameter devices increase in diameter, the inelastic linking element exerts a compressive force on the variable diameter devices, decreasing the distance (i.e., the pitch) between the shafts. As the variable diameter devices decrease in diameter, the inelastic linking element relaxes the compressive force on the variable diameter devices, increasing the distance between the shafts.

Abstract: A variable pitch clamshell hinge for use with clamshell housings includes a first shaft coupled to a first variable diameter device and a second shaft coupled to a second variable diameter device. The first variable diameter device and the second variable diameter device are coupled together using an inelastic linking element. As the shafts are rotated in a first direction the variable diameter devices increase in diameter. As the shafts are rotated in a second direction that is opposite the first direction, the variable diameter devices decrease in diameter. As the variable diameter devices increase in diameter, the inelastic linking element exerts a compressive force on the variable diameter devices, decreasing the distance (i.e., the pitch) between the shafts. As the variable diameter devices decrease in diameter, the inelastic linking element relaxes the compressive force on the variable diameter devices, increasing the distance between the shafts.

Abstract: A variable pitch clamshell hinge for use with clamshell housings includes a first shaft coupled to a first variable diameter device and a second shaft coupled to a second variable diameter device. The first variable diameter device and the second variable diameter device are coupled together using an inelastic linking element. As the shafts are rotated in a first direction the variable diameter devices increase in diameter. As the shafts are rotated in a second direction that is opposite the first direction, the variable diameter devices decrease in diameter. As the variable diameter devices increase in diameter, the inelastic linking element exerts a compressive force on the variable diameter devices, decreasing the distance (i.e., the pitch) between the shafts. As the variable diameter devices decrease in diameter, the inelastic linking element relaxes the compressive force on the variable diameter devices, increasing the distance between the shafts.