Abstract: A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.

Abstract: A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.

Abstract: The present invention is a method of using direct head electrical response signals for feedback process control. When lapping the air bearing surface of a bar of sliders, a magnetic field is applied to the air bearing surface and a bias current is applied to the reader elements. A head electrical response, such as amplitude or resistance change, is measured and is used to control the lapping device. Using a fixture which allows individual slider machining, a controller can be used to monitor the head response signal for each slider on the bar and individually control each slider on the bar so that material removal over each slider proceeds until a predetermined target stripe height is reached.

Abstract: A method for producing magneto resistive heads includes the steps of positioning at least two magneto resistive elements in spaced relation to one another and placing the at least two magneto resistive elements in an ion milling environment where material is removed nonselectively from items in the environment. A property of at least two of the plurality of magneto resistive elements is monitored. In response to monitoring, one of the at least two magneto resistive elements is dynamically covered to prevent additional removal of material from the covered magneto resistive element.

Abstract: An apparatus and method of machining sliders to obtain the optimum PTR for each slider. An array of MEMS devices configured for angular actuation are provided, and a slider is placed in each MEMS device of the array. The ion milling of the sliders is controlled individually for each slider based on the relationship of the ion angle and relative etch rates of the slider components. The MEMS devices are controlled to ensure the ion incidence angle for each slider is such that the desired PTR of each slider is achieved.

Abstract: A gimbal assembly includes a gimbal and a slider. The slider has at least one adhesive receiving feature which is formed on a mounting surface of the slider. The gimbal has a lock feature including at least one body that protrudes from a slider-engaging surface and terminates at a first end. Each body of the lock feature engages each adhesive receiving feature of the slider.

Abstract: An apparatus and method of machining sliders to obtain the optimum PTR for each slider. An array of MEMS devices configured for angular actuation are provided, and a slider is placed in each MEMS device of the array. The ion milling of the sliders is controlled individually for each slider based on the relationship of the ion angle and relative etch rates of the slider components. The MEMS devices are controlled to ensure the ion incidence angle for each slider is such that the desired PTR of each slider is achieved.

Abstract: An interfaced carrier assembly including an interface circuit having printed contacts to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material on the interface circuit and interface with terminal pads on a slider bar supported by a carrier plate for lapping feedback control. The interface circuit is assembled with the carrier plate with contacts on the interface circuit aligned with terminal pads on the slider bar supported by the carrier plate. Alignment of the terminal pads on the slider bar and contacts on the interface circuit are measured by digital cameras for assembly of the interfaced carrier assembly.

Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold for bidirectional actuation. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Abstract: A method for producing magneto resistive heads includes the steps of positioning at least two magneto resistive elements in spaced relation to one another and placing the at least two magneto resistive elements in an ion milling environment where material is removed nonselectively from items in the environment. A property of at least two of the plurality of magneto resistive elements is monitored. In response to monitoring, one of the at least two magneto resistive elements is dynamically covered to prevent additional removal of material from the covered magneto resistive element.

Abstract: A method and system for lapping a magnetic transducer using an electrical lapping guide is presented. This includes rough lapping the transducer based on a first signal and fine lapping the transducer based on a second signal from a dummy transducer. The dummy transducer can have electrical properties substantially similar to electrical properties of the magnetic transducer. The first signal can include a stripe height calculated as a function of a reference resistor element and an analog resistor element. The second signal can include lap to reader resistance from the dummy transducer and a stripe height calculated from a reference resistor element and an analog resistor element. The dummy transducer can also provide process noise monitoring capability during lapping.

Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold for bidirectional actuation. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Abstract: An interfaced carrier assembly including an interface circuit having printed contacts to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material on the interface circuit and interface with terminal pads on a slider bar supported by a carrier plate for lapping feedback control. The interface circuit is assembled with the carrier plate with contacts on the interface circuit aligned with terminal pads on the slider bar supported by the carrier plate. Alignment of the terminal pads on the slider bar and contacts on the interface circuit are measured by digital cameras for assembly of the interfaced carrier assembly.

Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Abstract: A lapping system data acquisition unit is disclosed for use in measuring resistances of multiple resistors embedded in a structure to be machined. Each of multiple independent current sources directs a current through one of the multiple resistors embedded in the structure during machining of a surface of the structure. Each of multiple voltage sensing devices couples to a separate one of the multiple resistors and provides a separate analog voltage output signal indicative of the resistance of the resistor. Each of multiple filters is coupled to a separate one of the multiple voltage sensing devices Analog-to-digital conversion circuitry coupled to the multiple filters generates a digitized signal for each of the filtered output signals.