Patents by Inventor Shanlin Ni

Shanlin Ni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8232852
    Abstract: The present invention relates to an integrated dual-track surface-wave filter comprising two input interdigital transducers, an output interdigital transducer, and a shield stripe therebetween, which are integrated on a piezoelectric wafer. The integrated dual-track surface-wave filter is characterized in that the two input interdigital transducers share one output interdigital transducer and one comb-like electrode that has a bus bar arranged at the middle thereof, and in that main lobe regions of apodized envelope curves on the two parallel input interdigital transducers are staggered to be at cross overlapping positions, and in that the bus bar on the common comb-like electrode is segmented to connect respective fingers on the two input interdigital transducers. In this manner, the present invention effectively narrows the chip area occupied, consumes less substrate materials and decreases the volume of the encapsulated enclosure, thereby reducing the manufacture cost effectively.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: July 31, 2012
    Assignee: Shoulder Electronics Co., Ltd.
    Inventors: Shanlin Ni, Weibiao Wang
  • Publication number: 20110260805
    Abstract: The present invention relates to an integrated dual-track surface-wave filter comprising two input interdigital transducers, an output interdigital transducer, and a shield stripe therebetween, which are integrated on a piezoelectric wafer. The integrated dual-track surface-wave filter is characterized in that the two input interdigital transducers share one output interdigital transducer and one comb-like electrode that has a bus bar arranged at the middle thereof, and in that main lobe regions of apodized envelope curves on the two parallel input interdigital transducers are staggered to be at cross overlapping positions, and in that the bus bar on the common comb-like electrode is segmented to connect respective fingers on the two input interdigital transducers. In this manner, the present invention effectively narrows the chip area occupied, consumes less substrate materials and decreases the volume of the encapsulated enclosure, thereby reducing the manufacture cost effectively.
    Type: Application
    Filed: December 24, 2008
    Publication date: October 27, 2011
    Inventors: Shanlin Ni, Weibiao Wang