Patents by Inventor Shannon Holly Williams

Shannon Holly Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120295442
    Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.
    Type: Application
    Filed: July 31, 2012
    Publication date: November 22, 2012
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Mary Jo Kulp, Shannon Holly Williams
  • Patent number: 8257544
    Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: September 4, 2012
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Mary Jo Kulp, Shannon Holly Williams
  • Publication number: 20100317261
    Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 16, 2010
    Inventors: Mary Jo Kulp, Shannon Holly Williams