Patents by Inventor Shanshan GU-STOPPEL
Shanshan GU-STOPPEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230382722Abstract: A method for encapsulating an MEMS structure in a stack structure includes providing a functional wafer structure including at least partly the MEMS structure. The method includes arranging the functional wafer structure and a glass wafer in the stack structure and along a stacking direction and is performed such that a cavity, in which at least part of the MEMS structure is arranged, is closed on one side along the stacking direction by the glass wafer and such that a spacing structure is arranged between the part of the MEMS structure and the glass wafer in the stack structure to provide a spacing between the part of the MEMS structure and the glass wafer along the stacking direction, such that the spacing structure encloses part of the cavity.Type: ApplicationFiled: August 7, 2023Publication date: November 30, 2023Inventors: Frank SENGER, Shanshan GU-STOPPEL, Erdem YARAR, Gunnar WILLE
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Publication number: 20230359020Abstract: A deflection device for Lissajous scanning is provided. The deflection device includes a frame and a mirror. The mirror is movably arranged in a recess in the frame by means of a suspension mount including one or more springs. The mirror may be configured to swing back and forth about each of two or three axes with a respective eigenfrequency for reflecting incoming light at different angles to form a two-dimensional Lissajous pattern. The deflection device may include a driving device configured to excite swing motion of the mirror about each of the two or three axes at or near the respective eigenfrequency. Each of the one or more springs has a shape of a path segment along a circumference of the mirror together covering more than 360 degrees. An arrangement of the one or more springs provides a compact suspension for the mirror and larger tilt angles.Type: ApplicationFiled: May 12, 2023Publication date: November 9, 2023Inventors: Ulrich HOFMANN, Fabian SCHWARZ, Oleg PETRAK, Aloshious Thottappattu JOY, Shanshan GU-STOPPEL, Frank SENGER, Frerk SOERENSEN, Yong CAO
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Patent number: 11350217Abstract: A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.Type: GrantFiled: November 22, 2019Date of Patent: May 31, 2022Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Fabian Stoppel, Bernhard Wagner, Shanshan Gu-Stoppel
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Publication number: 20220155103Abstract: A microsystem has a first support element and a second support element, wherein a relative position of the first support element and the second support element among each other is variable. The microsystem has a permanent-magnetic unit connected to the first support element in a mechanically fixed manner and configured to generate a magnetic field. Additionally, the microsystem has a sensor unit connected to the second support element in a mechanically fixed manner and configured to detect the magnetic field and provide a sensor signal which is based on the magnetic field. The sensor signal indicates a relative position of the support elements among one another.Type: ApplicationFiled: February 7, 2022Publication date: May 19, 2022Inventors: Thomas LISEC, Malte Florian NIEKIEL, Shanshan GU-STOPPEL, Fabian LOFINK
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Publication number: 20210371270Abstract: A MEMS includes a substrate having an element movably suspended relative to the substrate, the element having a first main surface and an opposite second main surface. The MEMS includes a first spring element connected between the substrate and a first column structure connected to the second main surface, and includes a second spring element connected between the substrate and a second column structure connected to the second main surface.Type: ApplicationFiled: August 10, 2021Publication date: December 2, 2021Inventors: Shanshan GU-STOPPEL, Malte Florian NIEKIEL, Thomas LISEC, Fabian LOFINK
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Publication number: 20210149187Abstract: Micro-Electro-Mechanical System (MEMS) devices may include at least one actuator. The actuator has a first end attachable to more than one side of a frame of the MEMS device, and has a second end attachable to a stage of the MEMS device, particularly via a joint. Further, the second end of the actuator is configured to bend upwards or downwards when the actuator is driven and the first end is attached.Type: ApplicationFiled: December 21, 2020Publication date: May 20, 2021Inventors: Shanshan GU-STOPPEL, Fabian LOFINK, Jide LIANG
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Publication number: 20200100033Abstract: A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.Type: ApplicationFiled: November 22, 2019Publication date: March 26, 2020Inventors: Fabian STOPPEL, Bernhard WAGNER, Shanshan GU-STOPPEL
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Patent number: 10101222Abstract: Embodiments of the present invention provide an apparatus including a micromirror, an excitation structure containing or supporting the micromirror, and at least one piezoelectric sensor. The excitation structure includes at least one piezoelectric actuator, the excitation structure being configured to resonantly excite the micromirror so as to cause a deflection of the micromirror. The at least one piezoelectric sensor is configured to provide a sensor signal dependent on the deflection of the micromirror, the piezoelectric sensor being connected to the excitation structure so that during the resonant excitation of the micromirror, the sensor signal and the deflection of the micromirror exhibit a fixed mutual phase relationship.Type: GrantFiled: September 4, 2015Date of Patent: October 16, 2018Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan Gu-Stoppel, Hans-Joachim Quenzer, Joachim Janes, Felix Heinrich
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Patent number: 10095023Abstract: Apparatuses with actuators having actuator-side attachment areas disposed thereon, an optical element having mirror-side attachment areas disposed thereon and springs are described, wherein an optical element is connected to actuators via two or four springs.Type: GrantFiled: May 28, 2014Date of Patent: October 9, 2018Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan Gu-Stoppel, Dirk Kaden, Christian Eisermann
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Patent number: 9733470Abstract: The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.Type: GrantFiled: May 16, 2014Date of Patent: August 15, 2017Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan Gu-Stoppel, Hans Joachim Quenzer, Joachim Janes
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Patent number: 9399573Abstract: The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.Type: GrantFiled: May 16, 2014Date of Patent: July 26, 2016Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan Gu-Stoppel, Hans Joachim Quenzer, Ulrich Hofmann
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Publication number: 20160069754Abstract: Embodiments of the present invention provide an apparatus including a micromirror, an excitation structure containing or supporting the micromirror, and at least one piezoelectric sensor. The excitation structure includes at least one piezoelectric actuator, the excitation structure being configured to resonantly excite the micromirror so as to cause a deflection of the micromirror. The at least one piezoelectric sensor is configured to provide a sensor signal dependent on the deflection of the micromirror, the piezoelectric sensor being connected to the excitation structure so that during the resonant excitation of the micromirror, the sensor signal and the deflection of the micromirror exhibit a fixed mutual phase relationship.Type: ApplicationFiled: September 4, 2015Publication date: March 10, 2016Inventors: Shanshan GU-STOPPEL, Hans-Joachim QUENZER, Joachim JANES, Felix HEINRICH
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Publication number: 20140355092Abstract: Apparatuses with actuators having actuator-side attachment areas disposed thereon, an optical element having mirror-side attachment areas disposed thereon and springs are described, wherein an optical element is connected to actuators via two or four springs.Type: ApplicationFiled: May 28, 2014Publication date: December 4, 2014Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan GU-STOPPEL, Dirk KADEN, Christian EISERMANN
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Publication number: 20140340726Abstract: The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.Type: ApplicationFiled: May 16, 2014Publication date: November 20, 2014Inventors: Shanshan GU-STOPPEL, Hans Joachim QUENZER, Joachim JANES
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Publication number: 20140339658Abstract: The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.Type: ApplicationFiled: May 16, 2014Publication date: November 20, 2014Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Shanshan GU-STOPPEL, Hans Joachim QUENZER, Ulrich HOFMANN