Abstract: Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive pad disposed on a second side of the first substrate, one or more thermal conductive features formed in the first substrate, wherein the thermal conductive features thermally connect the high-power chip and the thermal conductive pad, and a heat sink attached to a surface of the thermal conductive pad, wherein the heat sink is in thermal communication with the thermal conductive pad. By having thermal conductive features formed through the first substrate to thermally connect the high-power chip and the thermal conductive pad, heat generated by the high-power chip can be effectively dissipated into the heat sink.

Abstract: Various embodiments relating to semiconductor package structures having reduced thickness while maintaining rigidity are provided. In one embodiment, a semiconductor package structure includes a substrate including a surface, a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface, a mold compound applied to the substrate surrounding the semiconductor die. The second interface surface of the semiconductor die is exposed from the mold compound. The semiconductor package structure includes a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound.

Abstract: An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.

Abstract: A system, method, and computer program product are provided for affixing a post to a substrate pad. In use, a post is affixed to each of one or more pads of a substrate, where each post receives a ball of a package during an assembly process.

Abstract: Various embodiments relating to semiconductor package structures having reduced thickness while maintaining rigidity are provided. In one embodiment, a semiconductor package structure includes a substrate including a surface, a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface, a mold compound applied to the substrate surrounding the semiconductor die. The second interface surface of the semiconductor die is exposed from the mold compound. The semiconductor package structure includes a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound.

Abstract: An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.

Abstract: Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive pad disposed on a second side of the first substrate, one or more thermal conductive features formed in the first substrate, wherein the thermal conductive features thermally connect the high-power chip and the thermal conductive pad, and a heat sink attached to a surface of the thermal conductive pad, wherein the heat sink is in thermal communication with the thermal conductive pad. By having thermal conductive features formed through the first substrate to thermally connect the high-power chip and the thermal conductive pad, heat generated by the high-power chip can be effectively dissipated into the heat sink.

Abstract: Embodiments of the invention provide an IC system in which low-power chips can be positioned proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system may include a first substrate, a high-power chip embedded within the first substrate, a second substrate disposed on a first side of the first substrate, the first substrate and the second substrate are in electrical communication with each other, and a low-power chip disposed on the second substrate. In various embodiments, a heat distribution layer is disposed adjacent to the high-power chip such that the heat generated by the high-power chip can be effectively dissipated into an underlying printed circuit board attached to the first substrate, thereby preventing heat transfer from the high-power chip to the low-power chip. Therefore, the lifetime of the low-power chip is extended.

Abstract: A system, method, and computer program product are provided for preparing a substrate post. In use, a first solder mask is applied to a substrate. Additionally, a post is affixed to each of one or more pads of the substrate. Further, a second solder mask is applied to the substrate.

Abstract: A system, method, and computer program product are provided for affixing a post to a substrate pad. In use, a post is affixed to each of one or more pads of a substrate, where each post receives a ball of a package during an assembly process.

Abstract: A system in a package comprising a flip chip semiconductor die on a package substrate, a spacer on the package substrate, and a wire bond semiconductor die supported by the spacer and the flip chip semiconductor die.