Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.

Abstract: Embodiments of apparatus, methods, systems, devices, and connectors are described herein for a connector having a longitudinal body configured to mount the connector to a PCB. In various embodiments, a first and a second socket may be respectively disposed at a first side and a second side of the longitudinal body. In various embodiments, the first and second sockets may removably receive a first memory module from a first direction and a second memory module from a second direction opposite to the first direction. In various embodiments, the second side may be opposite to the first side. In various embodiments, on insertion into the first and second sockets, the first and second memory modules may be coplanar and/or equidistant from the PCB along a third direction orthogonal to the first and second directions.