Patents by Inventor Shanwu Chen

Shanwu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240421100
    Abstract: A package structure includes a first substrate, a second substrate, pins, and a first die. The package structure is connected to a printed circuit board through the pins. The first substrate includes a first routing layer, a first insulation layer, and a first metal layer that are sequentially stacked, and the second substrate includes a second routing layer, a second insulation layer, and a second metal layer that are sequentially stacked. The first metal layer is mechanically and electrically connected to a first part of the second routing layer, and the first metal layer and the first part of the second routing layer are connected to a quiescent point. At least one die is disposed on a surface that is of the first routing layer and that is away from the first metal layer, and a contact point between the die and the first routing layer is a moving point.
    Type: Application
    Filed: August 27, 2024
    Publication date: December 19, 2024
    Inventors: Xingzhong Zhang, Shanwu Chen, Jiebin Cheng, Baoshan Wu, Weiping Song
  • Publication number: 20230082478
    Abstract: This application provides a magnetic element, a power supply, and an electronic device. The magnetic element includes a magnetic core, a coil, and a skeleton, an accommodation space is provided in the magnetic core, and the coil is located in the accommodation space. Surfaces of the magnetic core include a first end face, a second end face, and a side surface connecting the first end face and the second end face. The skeleton is disposed on the side surface and is fixedly connected to the magnetic core. The first end face is flush with or protrudes from one end of the skeleton, and the second end face is flush with or protrudes from the other end of the skeleton.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 16, 2023
    Inventors: Peng Yu, Shanwu Chen, Xiao Wang