Patents by Inventor Shao-Cheng YEN

Shao-Cheng YEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200381338
    Abstract: A semiconductor device package includes a carrier, an electronic component, a package body and a ring structure. The electronic component is disposed on the carrier. The electronic component has a side surface. The package body is disposed on the carrier. The package body exposes at least a portion of the side surface of the electronic component. The ring structure is disposed on the package body and surrounds the portion of the side surface of the electronic component exposed from the package body.
    Type: Application
    Filed: June 3, 2019
    Publication date: December 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tang-Yuan CHEN, Yuan Tzuo LUO, Shao-Cheng YEN, Meng-Kai SHIH, Chih-Pin HUNG