Abstract: A method for forming a protective film on an electronic module includes: placing the electronic module and a protective material placed on the electronic module in a chamber; performing a first heating procedure on the protective material in the chamber, and performing a first pressure boosting procedure, wherein a pressure in the first pressure boosting procedure is greater than 1 atmosphere; after softening the protective material, maintaining the first heating procedure, and performing an oscillating decompression procedure on the chamber, wherein the oscillating decompression procedure includes alternately changing pressures in the chamber between multiple low pressures less than 1 atmosphere; maintaining the first heating procedure, and performing a second pressure boosting procedure on the chamber, wherein a pressure in the second boosting procedure is less than that of the first boosting procedure and greater than 1 atmosphere; and performing a second heating procedure on the protective material in the

Abstract: A material processing apparatus includes a processing chamber having an internal space, an external pressure source, a vacuum generator, a temperature regulator and a controller. The external pressure source is connected to the processing chamber for positive pressure action on the internal space. The vacuum generator is connected to the processing chamber for negative pressure action on the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source to increase the pressure in the processing chamber from a normal pressure to a first predetermined pressure, and configured to control the vacuum generator to reduce the pressure in the processing chamber to a second predetermined pressure less than the normal pressure after the pressure rises to the first predetermined pressure. An operating method of a material processing apparatus is also provided.

Abstract: A material processing apparatus including a processing chamber, an external pressure source, a pressure reducer, a temperature regulator, and a controller is provided. The processing chamber has an internal space. The external pressure source is connected to the processing chamber to pressurize the internal space. The pressure reducer is connected to the processing chamber to depressurize the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source and the temperature regulator to respectively increase the temperature to a first predetermined temperature and the pressure to a first predetermined pressure, and to control the pressure in the processing chamber to rise continuously before the temperature in the processing chamber rises to the first predetermined temperature. An operating method of a material processing apparatus is further provided.

Abstract: A method for forming a protective film on an electronic module includes: placing the electronic module and a protective material placed on the electronic module in a chamber; performing a first heating procedure on the protective material in the chamber, and performing a first pressure boosting procedure, wherein a pressure in the first pressure boosting procedure is greater than 1 atmosphere; after softening the protective material, maintaining the first heating procedure, and performing an oscillating decompression procedure on the chamber, wherein the oscillating decompression procedure includes alternately changing pressures in the chamber between multiple low pressures less than 1 atmosphere; maintaining the first heating procedure, and performing a second pressure boosting procedure on the chamber, wherein a pressure in the second boosting procedure is less than that of the first boosting procedure and greater than 1 atmosphere; and performing a second heating procedure on the protective material in the

Abstract: A material processing apparatus includes a processing chamber having an internal space, an external pressure source, a vacuum generator, a temperature regulator and a controller. The external pressure source is connected to the processing chamber for positive pressure action on the internal space. The vacuum generator is connected to the processing chamber for negative pressure action on the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source to increase the pressure in the processing chamber from a normal pressure to a first predetermined pressure, and configured to control the vacuum generator to reduce the pressure in the processing chamber to a second predetermined pressure less than the normal pressure after the pressure rises to the first predetermined pressure. An operating method of a material processing apparatus is also provided.

Abstract: A material processing apparatus including a processing chamber, an external pressure source, a pressure reducer, a temperature regulator, and a controller is provided. The processing chamber has an internal space. The external pressure source is connected to the processing chamber to pressurize the internal space. The pressure reducer is connected to the processing chamber to depressurize the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source and the temperature regulator to respectively increase the temperature to a first predetermined temperature and the pressure to a first predetermined pressure, and to control the pressure in the processing chamber to rise continuously before the temperature in the processing chamber rises to the first predetermined temperature. An operating method of a material processing apparatus is further provided.