Abstract: A heat dissipation device with a heat-insulating channel includes a thermal conductive substrate, multiple heat dissipation fins stacked with spacing from one another on the thermal conductive substrate, and at least one insulation guiding component. The heat dissipation fins have at least one configuration space for the insulation guiding component to be installed, a bottom portion, two sides upwardly extended from the bottom portion, and a channel enclosed by the bottom portion and two sides. A width of the channel is at least greater than the spacing between any two adjacent heat dissipation fins.

Abstract: A vapor chamber supporting capillary structure includes a first plate, a second plate and a capillary layer. The capillary layer is clamped between the first plate and the second plate and includes a first capillary portion and a second capillary portion. The second capillary portion is connected to the first capillary portion and extends outward, and a notch is formed at any one side of the second capillary portion. The notch is formed along an extension direction of the second capillary portion. Furthermore, the first plate includes a plurality of capillary supporting structures and a plurality of plate supporting structures formed thereon, and the capillary supporting structures are corresponding to the first capillary portion and the second capillary portion, and the plate supporting structures are corresponding to the notch. Accordingly, a greater steam space may be obtained.