Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.

Abstract: A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad. The reversed-L-shaped pad is disposed in proximity to an apex of the corner of the surface mount region.

Abstract: A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch.

Abstract: A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.

Abstract: A keypad device including a parallel/serial conversion device, a keypad module, and a controller coupled to the parallel/serial conversion device and the keypad module. The keys in the keypad module are arranged in parallel. After the key is triggered, an interrupt signal will be fed to the controller. On receiving the interrupt signal, the controller will feed a drive voltage to the keypad module generating a parallel signal therein. After causing the parallel/serial conversion device to read and store the parallel signal, the controller will be able to read the parallel signal serially by using the clock signals. The status of the keypad module can thereby be obtained.

Abstract: A keypad device including a parallel/serial conversion device, a keypad module, and a controller coupled to the parallel/serial conversion device and the keypad module. The keys in the keypad module are arranged in parallel. After the key is triggered, an interrupt signal will be fed to the controller. On receiving the interrupt signal, the controller will feed a drive voltage to the keypad module generating a parallel signal therein. After causing the parallel/serial conversion device to read and store the parallel signal, the controller will be able to read the parallel signal serially by using the clock signals. The status of the keypad module can thereby be obtained.