Patents by Inventor Shao-En HWANG

Shao-En HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527936
    Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: January 7, 2020
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Cheng-Chung Lee, Yeong-Tong Hwang, Shih-Hung Hsu, Shao-En Hwang
  • Publication number: 20170363958
    Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 21, 2017
    Inventors: Cheng-Chung LEE, Yeong-Tong HWANG, Shih-Hung HSU, Shao-En HWANG