Abstract: The present disclosure provides a defect inspecting method and a defect inspecting system configured to inspect a memory device. The defect inspecting method includes the operations of: resetting the memory device from a power on state; initializing the memory device; performing a plurality of write operations to a memory cell array of the memory device according to a test pattern; performing a plurality of read operations to the memory cell array of the memory cell to generate a readout pattern; and determining whether a defect existed in the memory device according to the readout pattern.

Abstract: A soldering iron tip is used for heating a solder bar during a soldering operation so as to solder a workpiece. An end surface of the soldering iron tip has a guide hole, and the guide hole forms a channel in the soldering iron tip. Meanwhile, a side surface of the soldering iron tip has a through hole in communication with the channel. When the soldering operation is performed, relative positions of the guide hole and the workpiece overlap each other. After the solder bar is made to pass through the through hole and heated inside the channel, the molten solder bar flows along the channel to reach the workpiece via the guide hole, thereby completing the soldering operation.