Abstract: A method for preparing core-shell and hollow silver particles is provided. In the method silver salts and glycine nitrate or starch are mixed with solvent to form precursor solution. The mole percentage of the silver salts over the silver salts plus glycine nitrate or starch is 5 to 50 mol %. The precursor solution is then atomized to form precursor droplets. The precursor droplets are heated by pyrolysis to form silver particles. The composition of the precursor solution can be adjusted to finely manipulate the structure of the silver particles.

Abstract: A method for manufacturing bioactive glass includes the steps below. A precursor and a polar solvent are mixed to form a mixed solution, in which the precursor includes a silicon precursor, a calcium precursor and a phosphorus precursor. The mixed solution is atomized to form a mixture droplet. The mixture droplet is oxidized in an environment of 500° C. to 900° C. to form the bioactive glass.

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.).

Abstract: A platinum-free and palladium-free conductive adhesive includes silver particles, additive metal particles and a binder. Components of the additive metal particles are selected from the group consisting of tungsten, niobium, tantalum and molybdenum etc., and do not contain platinum and palladium. The binder adheres the silver particles and the additive metal particles together. A specific weight percentage of the additive metal particles in a mixture of the silver particles and the additive metal particles ranges from 1 to 70. The presence of the additive metal particles can suppress silver migration. An electrode formed by the conductive adhesive is also disclosed.

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.).

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.