Patents by Inventor Shao Jun Yu

Shao Jun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fiber optics printed circuit board assembly surface cleaning and roughening
    Patent number: 11555973
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: January 17, 2023
    Assignee: II-VI DELAWARE, INC.
    Inventors: Tao Chen, Cheng Jie Dong, Jin Jiang, Ting Shi, Shao Jun Yu, You Ji Liu
  • Electrical coupling assemblies and methods for optoelectronic modules
    Patent number: 11139412
    Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: October 5, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Tao Sun, Feng Wang, Wei Peng Nian, Ting Shi, Bing Qiu, Shao Jun Yu
  • FIBER OPTICS PRINTED CIRCUIT BOARD ASSEMBLY SURFACE CLEANING AND ROUGHENING
    Publication number: 20200371301
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.
    Type: Application
    Filed: August 14, 2020
    Publication date: November 26, 2020
    Inventors: Tao Chen, Cheng Jie Dong, Jin Jiang, Ting Shi, Shao Jun Yu, You Ji Liu
  • ELECTRICAL COUPLING ASSEMBLIES AND METHODS FOR OPTOELECTRONIC MODULES
    Publication number: 20200357946
    Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.
    Type: Application
    Filed: May 22, 2019
    Publication date: November 12, 2020
    Inventors: Tao SUN, Feng WANG, Wei Peng NIAN, Ting SHI, Bing QIU, Shao Jun YU
  • Fiber optics printed circuit board assembly surface cleaning and roughening
    Patent number: 10816741
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 27, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Tao Chen, Cheng Jie Dong, Jin Jiang, Ting Shi, Shao Jun Yu, You Ji Liu
  • FIBER OPTICS PRINTED CIRCUIT BOARD ASSEMBLY SURFACE CLEANING AND ROUGHENING
    Publication number: 20190377141
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 12, 2019
    Inventors: Tao CHEN, Cheng Jie Dong, Jin Jiang, Ting Shi, Shao Jun Yu, You Ji Liu