Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A probe installation circuit board includes an insulating layer provided on upper and lower surfaces thereof with a trace structure including two grounding traces and a signal trace located therebetween, and a grounding layer. Each grounding trace is connected with the grounding layer by at least one conductive via including a through hole penetrating through the grounding trace and the insulating layer, and a conductive layer disposed therein to electrically connect the grounding trace and layer. The signal trace and the conductive layers are made of a metal material. The grounding layer and traces are made of another metal material. A probe device includes the circuit board and three probes disposed on the traces respectively. The present invention is capable of thin copper traces and lowered trace surface roughness, easy in control of trace distance, width and thickness, and beneficial to achieve the fine pitch requirement.

Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: A microelectromechanical probe has tail, head and body portions, and includes a pinpoint layer having a planarized top surface where a structural layer having first and second sides, a cutting face and a front terminal surface adjoining the first and second sides is disposed. The cutting face descends from the top surface of the structural layer toward the pinpoint layer to the front terminal surface. The front terminal surface extends from a front end of the cutting face to the top surface of the pinpoint layer. The pinpoint layer has a pinpoint protruding over the front terminal surface and located at the head portion. Within the head portion, the pinpoint layer is greater in hardness and less in electrical conductivity than the structural layer. The probe makes small probing marks, is highly recognizable in an automatic pinpoint recognition process, and can be conveniently installed.

Abstract: A microelectromechanical probe is manufactured by a MEMS manufacturing process forming a probe body and a cutting process providing a pinpoint portion a cutting face. The probe has a top surface, a body portion, and a pinpoint portion extended in a probing direction from the body portion and provided with first and second sides and a probing end oriented in the probing direction. The cutting face is provided on the top surface, adjoins the first and second sides and the probing end, and has at least one cut mark formed by the cutting process, extended from the first side to the second side and non-parallel to the probing direction. The cutting face descends from an edge cut mark to the probing end.

Abstract: A probe for a probe head having lower and upper dies includes a main portion, a conductive portion stacked on at least a part of the main portion, an attachment layer covering the main portion and the conductive portion, a skin effect layer covering the attachment layer, and a stopping portion for being abutted against the lower or upper die. The main portion includes a first material. The conductive portion includes a second material. The skin effect layer includes a third material. The electrical conductivity of the third material is greater than that of the second material. The electrical conductivity of the second material is greater than that of the first material. The hardness of the first material is greater than that of the second material, and also greater than that of the third material.