Patents by Inventor Shao-Meng Sim

Shao-Meng Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test equipment and test device thereof
    Patent number: 11747382
    Abstract: Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder. The cylinder is disposed in the perforation to act as a cavity for the antenna testing process. Therefore, only the cylinder needs to be replaced when the antenna testing process is performed on different devices under test, with the whole testing head intact.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: September 5, 2023
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
  • TEST EQUIPMENT AND TEST DEVICE THEREOF
    Publication number: 20210123962
    Abstract: Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder. The cylinder is disposed in the perforation to act as a cavity for the antenna testing process. Therefore, only the cylinder needs to be replaced when the antenna testing process is performed on different devices under test, with the whole testing head intact.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 29, 2021
    Inventors: Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
  • SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND
    Publication number: 20140264958
    Abstract: A semiconductor package is disclosed, which includes: a substrate body; a semiconductor element disposed on the substrate body; and a molding compound forms on the substrate body for encapsulating the semiconductor element. The molding compound contains a metal oxide so as to have a high insulation impedance and a high heat dissipating rate and be capable of suppressing electromagnetic interference.
    Type: Application
    Filed: August 16, 2013
    Publication date: September 18, 2014
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu, Kwok-Yan Lam, Shao-Meng Sim