Patents by Inventor Shao-Min Yang

Shao-Min Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER PRETREATMENT FOR COPPER ELECTROPLATING
    Publication number: 20120175264
    Abstract: The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comprises copper ions.
    Type: Application
    Filed: September 22, 2010
    Publication date: July 12, 2012
    Applicant: BASF SE
    Inventors: Chien-Hsun Lai, Shao-Min Yang, Tzu-Tsang Huang
  • COPPER ELECTROPLATING COMPOSITION
    Publication number: 20120175744
    Abstract: The present invention relates to a copper electroplating composition comprising a copper alkanesulfonate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition.
    Type: Application
    Filed: September 15, 2010
    Publication date: July 12, 2012
    Applicant: BASF SE
    Inventors: Chien-Hsun Lai, Tzu-Tsang Huang, Shao-Min Yang, ChiaoHao Chan