Abstract: A wavelength conversion device includes a wavelength conversion element, at least one condenser lens, at least one fixing device, a heat dissipation wind flow device, and a wind guide structure. The wavelength conversion element includes a substrate, a wavelength conversion layer, and a driving component. The substrate has a first surface and a second surface opposite to each other. The wavelength conversion layer is disposed on the first surface, and the driving component drives the substrate to rotate about a rotary shaft of the driving component as a central axis. The condenser lens is arranged on one side of the first surface of the wavelength conversion element and fixed to the fixing device. The fixing device has at least one vent. The wind guide structure is connected to the heat dissipation wind flow device and the vent.

Abstract: A wavelength conversion module includes a wavelength conversion unit, a support bracket, a lens holder, a condenser lens, and a thermally conductive material. The wavelength conversion unit is disposed on the support bracket. The lens holder is disposed on the support bracket, and has an accommodation space to accommodate the condenser lens. An inner wall of the lens holder is arranged with a bearing surface. The condenser lens has an annular assembly surface. The condenser lens is disposed on the bearing surface through the annular assembly surface to be fixed to the lens holder. The thermally conductive material is disposed between the annular assembly surface of the condenser lens and the bearing surface of the lens holder to transfer heat from the condenser lens to the lens holder.

Abstract: A projection device includes a housing, and a light source module, an optical engine module, a liquid cooling module, a first fan group and a projection lens disposed in an accommodating space. A light emitting side plate, an air outlet side plate, and a first and a second side plate surround the accommodating space. The air outlet side plate has an air outlet, and at least one of the light emitting side plate, and the first and the second side plate has at least one air inlet. The liquid cooling module includes a heat exchanger. The first fan group is located between the heat exchanger and the air outlet. An orthographic projection area of the cooling fin set of the heat exchanger on the air outlet side plate is smaller than or equal to an orthographic projection area of the first fan group on the air outlet side plate.

Abstract: A heat dissipation module includes an airtight structure and a thermoelectric cooling element. The airtight structure includes a first workpiece, a second workpiece and a compressible element. The first workpiece has a first airtight portion having a plurality of first protrusions. The second workpiece configured in alignment with the first workpiece has a second airtight portion having a plurality of second protrusions. The compressible element is configured between the first airtight portion and the second airtight portion, wherein a part of the compressible element is located in gaps of the first protrusions and gaps of the second protrusions. The thermoelectric cooling element configured between the first workpiece and the second workpiece partially contacts the first workpiece, wherein the heating element is configured on a side of the first workpiece away from the thermoelectric cooling element.

Abstract: A cooling system includes a flow channel structure including flow channel substrates, a first outer substrate, a first inner adsorption layer, a first outer adsorption layer, and a first heat insulating layer and a first cooling chip having a cold side and a hot side opposite to each other. The flow channel substrates surround to form an air flow channel and include a first inner substrate with a second surface facing the air flow channel and a first surface disposed on the cold side. A first surface of the first outer substrate is disposed on the hot side. The first inner adsorption layer is disposed on the second surface of the first inner substrate. The first outer adsorption layer is disposed on a second surface of the first outer substrate. The first heat insulating layer is disposed between the first inner substrate and the first outer substrate.