Abstract: A system and method for cleaning a preclean process chamber in between wafer processing. The internal pressure of the preclean process chamber is reduced to a first pressure and a first gas that consists of oxygen and an inert or noble gas, is introduced into the chamber. Plasma is generated within the preclean process chamber using the first gas at the first pressure. Internal pressure is then reduced to a second pressure, less than the first, and the first gas is continued into the chamber. Plasma is then generated using the first gas at the second pressure. Thereafter, a second gas, consisting of an oxygen-free inert or noble gas, is introduced into the chamber at the second pressure, following which plasma is generated within the chamber using only the second gas.

Abstract: A memory device is disclosed. The memory device includes a memory array comprising a plurality of memory cells. At least a first one of the memory cells, by default, permanently presents a first logic state based on a short circuit. At least a second one of the memory cells, by default, permanently presents a second logic state opposite to the first logic state based on an open circuit.

Abstract: A fusible structure includes: a metal line in a first metal layer extending along a first direction; and a first dummy structure disposed proximal to the metal line relative to a second direction, the second direction being perpendicular to the first direction, the first dummy structure being in a second metal layer. Relative to the first direction, the metal line includes first, second and third portions, the second portion being between the first portion and third portion. Relative to a third direction that is perpendicular to the first direction and the second direction, the first portion has a first thickness and the second portion has a second thickness, the first thickness being greater than the second thickness.

Abstract: A method (fabricating a fusible structure) includes forming a metal line that extends in a first direction, the forming a metal line including: configuring the mask such that the metal line has a first portion that is between a second portion and a third portion; and using an optical proximity correction technique with a mask so that the first portion has a first thickness that is thinner than a second thickness of each of the second portion and the third portion; and forming a first dummy structure proximal to the metal line and aligned with the first portion relative to the first direction.

Abstract: A memory circuit includes a bias voltage generator including a first buffer configured to generate a first bias voltage based on a reference voltage and a plurality of second buffers configured to generate a plurality of second bias voltages based on the first bias voltage. The memory circuit includes a plurality of voltage clamp devices coupled to the plurality of second buffers, and each voltage clamp device is configured to apply a drive voltage to a corresponding resistance-based memory device of a plurality of resistance-based memory devices based on the corresponding second bias voltage of the plurality of second bias voltages.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A fusible structure includes: a metal line in a first metal layer extending along a first direction; and a first dummy structure disposed proximal to the metal line relative to a second direction, the second direction being perpendicular to the first direction, the first dummy structure being in a second metal layer. Relative to the first direction, the metal line includes first, second and third portions, the second portion being between the first portion and third portion. Relative to a third direction that is perpendicular to the first direction and the second direction, the first portion has a first thickness and the second portion has a second thickness, the first thickness being greater than the second thickness.

Abstract: A memory circuit includes a bias voltage generator including a first buffer configured to generate a first bias voltage based on a reference voltage and a plurality of second buffers configured to generate a plurality of second bias voltages based on the first bias voltage. The memory circuit includes a plurality of voltage clamp devices coupled to the plurality of second buffers, and each voltage clamp device is configured to apply a drive voltage to a corresponding resistance-based memory device of a plurality of resistance-based memory devices based on the corresponding second bias voltage of the plurality of second bias voltages.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A fusible structure includes a metal line with different portions having different thicknesses. Thinner portions of the metal line are designed to be destructively altered at lower voltages while thicker portions of the metal line are designed to be destructively altered at lower voltages. Furthermore, one or more dummy structures are disposed proximal to the thinner portions of the metal line. In some embodiments, dummy structures are placed with sufficient proximity so as to protect against metal sputtering when metal line is destructively altered.

Abstract: A bias voltage generator includes a first current path, a first voltage clamp device, and a first buffer. The bias voltage generator receives a reference voltage and generates a first bias voltage based on a voltage difference between the reference voltage and a first drive voltage, the first voltage clamp device generates the first drive voltage based on the first bias voltage by applying the first drive voltage to the first current path, and the first buffer receives the first bias voltage and generates a second bias voltage based on the first bias voltage. A second current path includes a resistance-based memory device, and a second voltage clamp device generates a second drive voltage based on the second bias voltage and applies the second drive voltage to the second current path.

Abstract: A method (fabricating a fusible structure) includes forming a metal line that extends in a first direction, the forming a metal line including: configuring the mask such that the metal line has a first portion that is between a second portion and a third portion; and using an optical proximity correction technique with a mask so that the first portion has a first thickness that is thinner than a second thickness of each of the second portion and the third portion; and forming a first dummy structure proximal to the metal line and aligned with the first portion relative to the first direction.

Abstract: A fusible structure includes a metal line with different portions having different thicknesses. Thinner portions of the metal line are designed to be destructively altered at lower voltages while thicker portions of the metal line are designed to be destructively altered at lower voltages. Furthermore, one or more dummy structures are disposed proximal to the thinner portions of the metal line. In some embodiments, dummy structures are placed with sufficient proximity so as to protect against metal sputtering when metal line is destructively altered.

Abstract: A bias voltage generator includes a first current path, a first voltage clamp device, and a first buffer. The bias voltage generator receives a reference voltage and generates a first bias voltage based on a voltage difference between the reference voltage and a first drive voltage, the first voltage clamp device generates the first drive voltage based on the first bias voltage by applying the first drive voltage to the first current path, and the first buffer receives the first bias voltage and generates a second bias voltage based on the first bias voltage. A second current path includes a resistance-based memory device, and a second voltage clamp device generates a second drive voltage based on the second bias voltage and applies the second drive voltage to the second current path.