Patents by Inventor Shao-Tung PENG

Shao-Tung PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10535602
    Abstract: An integrated circuit structure includes a first fuse line formed in a first metal layer; a second fuse line formed in the first metal layer; a first pair of fuse wings formed in the first metal layer on opposite sides of a first end of the first fuse line; a second pair of fuse wings formed in the first metal layer on opposites sides of a first end of the second fuse line; a third pair of fuse wings formed in the first metal layer on opposite sides of a second end of the first fuse line; and a fourth pair of fuse wings formed in the first metal layer on opposites sides of a second end of the second fuse line. The first and second pairs of fuse wings share a first common fuse wing and the third and fourth pairs of wings share a second common fuse wing.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Sheng Chang, Shao-Tung Peng, Shao-Yu Chou, Liang Chuan Chang, Yao-Jen Yang
  • Publication number: 20190287900
    Abstract: An integrated circuit structure includes a first fuse line formed in a first metal layer; a second fuse line formed in the first metal layer; a first pair of fuse wings formed in the first metal layer on opposite sides of a first end of the first fuse line; a second pair of fuse wings formed in the first metal layer on opposites sides of a first end of the second fuse line; a third pair of fuse wings formed in the first metal layer on opposite sides of a second end of the first fuse line; and a fourth pair of fuse wings formed in the first metal layer on opposites sides of a second end of the second fuse line. The first and second pairs of fuse wings share a first common fuse wing and the third and fourth pairs of wings share a second common fuse wing.
    Type: Application
    Filed: November 28, 2018
    Publication date: September 19, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Sheng Chang, Shao-Tung Peng, Shao-Yu Chou, Liang Chuan Chang, Yao-Jen Yang
  • Patent number: 10163783
    Abstract: An integrated circuit structure includes a first fuse line formed in a first metal layer; a second fuse line formed in the first metal layer; a first pair of fuse wings formed in the first metal layer on opposite sides of a first end of the first fuse line; a second pair of fuse wings formed in the first metal layer on opposites sides of a first end of the second fuse line; a third pair of fuse wings formed in the first metal layer on opposite sides of a second end of the first fuse line; and a fourth pair of fuse wings formed in the first metal layer on opposites sides of a second end of the second fuse line. The first and second pairs of fuse wings share a first common fuse wing and the third and fourth pairs of wings share a second common fuse wing.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Sheng Chang, Shao-Tung Peng, Shao-Yu Chou, Liang Chuan Chang, Yao-Jen Yang
  • Patent number: 9401258
    Abstract: A fuse structure comprises a first conductive layer on a first level. The first conductive layer comprises a fuse line extending in a first direction. The fuse line has a first end portion, a second end portion opposite the first end portion, and a fuse link portion connecting the first end portion and the second end portion. The first conductive layer also comprises lines parallel to the fuse line, the lines being aligned in the first direction and being separated from one another by a first distance measured in the first direction. The fuse structure also comprises a second conductive layer on a second level different from the first level and coupled with the first conductive layer. The second conductive layer has parallel lines extending in a second direction, the parallel lines being separated by a second distance measured in a third direction orthogonal to the second direction.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 26, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Ming Hung, Yun-Han Chen, Shao-Tung Peng, Shao-Yu Chou, Yue-Der Chih, Li-Chun Tien
  • Publication number: 20160035527
    Abstract: A fuse structure comprises a first conductive layer on a first level. The first conductive layer comprises a fuse line extending in a first direction. The fuse line has a first end portion, a second end portion opposite the first end portion, and a fuse link portion connecting the first end portion and the second end portion. The first conductive layer also comprises lines parallel to the fuse line, the lines being aligned in the first direction and being separated from one another by a first distance measured in the first direction. The fuse structure also comprises a second conductive layer on a second level different from the first level and coupled with the first conductive layer. The second conductive layer has parallel lines extending in a second direction, the parallel lines being separated by a second distance measured in a third direction orthogonal to the second direction.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 4, 2016
    Inventors: Chen-Ming HUNG, Yun-Han CHEN, Shao-Tung PENG, Shao-Yu CHOU, Yue-Der CHIH, Li-Chun TIEN