Patents by Inventor Shao Wei Li

Shao Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200190348
    Abstract: The present disclosure is drawn to inkjet inks, which can include an aqueous ink vehicle and a pigment particle having a block copolymer attached to a surface of the pigment particle. The block copolymer can be linked to the surface through a silyl coupling group. The block copolymer can include a steric stabilizing block formed by polymerizing a monomer having a sterically bulky group, and an ionic stabilizing block formed by polymerizing a monomer having an acidic group or a basic group.
    Type: Application
    Filed: September 19, 2017
    Publication date: June 18, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Zhang-Lin Zhou, Shao-Wei LI, Gregg A. LANE
  • Publication number: 20200164661
    Abstract: Herein is disclosed a method of transfer inkjet printing comprising jetting a radiation curable inkjet ink onto an intermediate transfer member of an inkjet printer to form an image; irradiating the radiation curable inkjet ink on the intermediate transfer member to form an at least partially cured image; and transferring the at least partially cured image to a substrate to form a printed substrate. Herein is also disclosed a transfer inkjet printing apparatus adapted, in use, to perform the method.
    Type: Application
    Filed: September 25, 2017
    Publication date: May 28, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Zhang-Lin Zhou, Rodney David Stramel, Gregg A. Lane, Shao-Wei Li, Brian J. Keefe
  • Publication number: 20200158646
    Abstract: A surface-enhanced Raman scattering (SERS) detection method is provided for detecting a target analyte in a sample. The SERS detection method generally includes the steps of: (a). preparing an extract of the sample; (b). introducing the sample extract onto a SERS substrate, causing the target analyte to be absorbed in the SERS substrate; (c). introducing a volatile organic solvent onto the SERS substrate to have the target analyte of the sample extract dissolved and comes out of the SERS substrate; (d). irradiating the SERS substrate with light to evaporate the volatile organic solvent, leaving a more condensed target analyte on the SERS substrate; (e). irradiating the condensed target analyte with laser light to have the target analyte penetrate deeply into the SERS substrate; and (f). performing Raman measurement with a laser beam focusing on the SERS substrate to analyze the target analyte.
    Type: Application
    Filed: July 20, 2017
    Publication date: May 21, 2020
    Inventors: CHAO-MING TSEN, CHING-WEI YU, WEI-CHUNG CHAO, YUNG-HSIANG WANG, CHENG-CHIEN LI, SHAO-KAI LIN, TZU-HUNG HSU, CHANG-JUNG WEN
  • Publication number: 20200148806
    Abstract: The present disclosure is drawn to polyurethane dispersions. In one example, a polyurethane dispersion can include a polyurethane with a polymeric ionic side chain and a polymeric non-ionic side chain. The polyurethane can be formed of polymerized monomers including a diisocyanate, a first polymeric diol, and a second polymeric diol. The first polymeric diol can include a first polymer chain replacing a hydrogen atom of a thiol group of a 1-thioglycerol molecule. The first polymer chain can include a block of a polymerized ionic group-containing vinyl monomer. The second polymeric diol can include a second polymer chain replacing a hydrogen atom of a thiol group of a 1-thioglycerol molecule. The second polymer chain can include a block of a polymerized non-ionic vinyl monomer, and the second polymer chain can be devoid of ionic groups.
    Type: Application
    Filed: October 19, 2017
    Publication date: May 14, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Zhang-Lin Zhou, Shao-Wei Li, Gregg A. LANE
  • Publication number: 20200123400
    Abstract: The present disclosure is drawn inkjet inks, which can include an aqueous ink vehicle and a pigment particle having a block copolymer attached to a surface of the pigment particle. The block copolymer can be linked to the surface through a nitrogen atom-containing coupling group bonded to the surface through the nitrogen atom. The block copolymer can include a steric stabilizing block formed by polymerizing a monomer having a sterically bulky group, and an ionic stabilizing block formed by polymerizing a monomer having an acidic group or a basic group.
    Type: Application
    Filed: September 19, 2017
    Publication date: April 23, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Zhang-Lin Zhou, Shao-Wei LI
  • Patent number: 10534282
    Abstract: The present disclosure discloses a charge roller (1) particularly but not exclusively for charging a photoconductor in a liquid electro-photograph (LEP) image-forming apparatus. The charge roller includes a cured composition of an epichlorohydrin/ethylene oxide/allyl glycidyl ether terpolymer, a lithium salt and carbon black.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: January 14, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yi Feng, Stanley J. Kozmiski, Shao-Wei Li
  • Publication number: 20190375959
    Abstract: The present disclosure is drawn to pigment dispersions including from 5 wt % to 30 wt % of a pigment having an amide group, a styrene acrylic polymer having a weight average molecular weight from 3,000 Mw to 30,000 Mw and having a weight ratio to the pigment of from 1:1 to 1:10, a lactam co-solvent having a weight ratio to the pigment of from 10:1 to 1:10, and water. The lactam co-solvent can be co-milled with the pigment and an at least 5 wt % portion of the lactam co-solvent can be adsorbed on the pigment via van der waals interaction with the amide group.
    Type: Application
    Filed: April 7, 2017
    Publication date: December 12, 2019
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kai-Kong IU, Stone S. OUYANG, Shao-Wei LI, Shonna Anne DAWN, Dennis Z. GUO
  • Patent number: 10497847
    Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: December 3, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Fang Liu, Shao-Chien Lee, Chen-Wei Tseng, Zong-Hua Li
  • Patent number: 9423716
    Abstract: The present disclosure discloses a new charge roller particularly but not exclusively for charging a photoconductive element in a liquid electro-photograph (LEP) image-forming apparatus. The charge roller includes a cured composition of an aromatic diisocyanate, a polycarbonate polyester polyol, a matte agent, a surface energy modifier, and a conductive agent.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: August 23, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shao-Wei Li, Yi Feng, Stanley J. Kozmiski
  • Publication number: 20150018181
    Abstract: The present disclosure discloses a new charge roller particularly but not exclusively for charging a photoconductive element in a liquid electro-photograph (LEP) image-forming apparatus. The charge roller includes a cured composition of an aromatic diisocyanate, a polycarbonate polyester polyol, a matte agent, a surface energy modifier, and a conductive agent.
    Type: Application
    Filed: March 1, 2012
    Publication date: January 15, 2015
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY,L.P.
    Inventors: Shao-Wei Li, Yi Feng, Stanley J. Kozmiski
  • Publication number: 20150018182
    Abstract: The present disclosure discloses a charge roller (1) particularly but not exclusively for charging a photoconductor in a liquid electro-photograph (LEP) image-forming apparatus. The charge roller includes a cured composition of an epichlorohydrin/ethylene oxide/allyl glycidyl ether terpolymer, a lithium salt and carbon black.
    Type: Application
    Filed: March 1, 2012
    Publication date: January 15, 2015
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yi Feng, Stanley J. Kozmiski, Shao-Wei Li
  • Publication number: 20130085217
    Abstract: The present disclosure provides inks, ink sets, and method for manufacturing inkjet inks. The inkjet ink comprises a colorant; a liquid vehicle; a surfactant; and a polyurethane binder, the polyurethane binder including polymerized monomers of a polyether polyol, a diisocyanate, and an acid polyol, where the polyurethane binder has a Mw from about 35K to 50K and an acid number from 51 to 60.
    Type: Application
    Filed: June 17, 2010
    Publication date: April 4, 2013
    Applicant: Hewlett-Packard Development Company, LP
    Inventors: Kai-Kong Iu, Shao-Wei Li, Dennis Z. Guo, Yubai Bi, Minedys Macias Guzman
  • Patent number: 8011775
    Abstract: An ink set includes a red ink and a magenta ink. The red ink includes an effective amount of a red pigment having a predetermined red/green lambda cutoff, and the magenta ink includes an effective amount of a magenta pigment having a predetermined red/green lambda cutoff that is substantially similar to the predetermined lambda cutoff of the red pigment.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: September 6, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zeying Ma, Alexey S. Kabalnov, Shao-Wei Li, Dennis Z. Guo, Stephen W. Bauer
  • Publication number: 20090033728
    Abstract: An ink set includes a red ink and a magenta ink. The red ink includes an effective amount of a red pigment having a predetermined red/green lambda cutoff, and the magenta ink includes an effective amount of a magenta pigment having a predetermined red/green lambda cutoff that is substantially similar to the predetermined lambda cutoff of the red pigment.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 5, 2009
    Inventors: Zeying Ma, Alexey S. Kabalnov, Shao-Wei Li, Dennis Z. Guo, Stephen W. Bauer
  • Patent number: 6844379
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: January 18, 2005
    Assignee: Honeywell International Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
  • Publication number: 20030166746
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Application
    Filed: November 19, 2002
    Publication date: September 4, 2003
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6489380
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 3, 2002
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6242513
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 5, 2001
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6057402
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: May 2, 2000
    Assignee: Johnson Matthey, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 5744533
    Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: April 28, 1998
    Assignee: Johnson Matthey, Inc.
    Inventors: Nancy E. Iwamoto, Jesse L. Pedigo, Shao Wei Li, Alan Grieve