Patents by Inventor Shao-Yen Chang
Shao-Yen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088023Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
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Patent number: 11923243Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.Type: GrantFiled: August 30, 2021Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
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Patent number: 11661480Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.Type: GrantFiled: December 31, 2020Date of Patent: May 30, 2023Assignee: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin
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Publication number: 20230127585Abstract: A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.Type: ApplicationFiled: December 21, 2022Publication date: April 27, 2023Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin, Yuan-Pei Liao, Yi-Cang Lai
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Patent number: 11572639Abstract: A fiber masterbatch including a polyetherimide, a polyethylene terephthalate, and a polyimide is provided. A glass transition temperature of the polyimide is between 140° C. and 170° C., a 10% thermogravimetric loss temperature of the polyimide is between 500° C. and 550° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and a solid content of the polyimide is 15 wt %, a viscosity of the polyimide is between 80 cP and 230 cP. A melt spun fiber obtained by using the fiber masterbatch is also provided.Type: GrantFiled: September 29, 2020Date of Patent: February 7, 2023Assignee: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin, Yuan-Pei Liao, Yi-Cang Lai
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Publication number: 20220178071Abstract: A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.Type: ApplicationFiled: December 2, 2021Publication date: June 9, 2022Inventors: Shao-Yen CHANG, Shang-Chih CHOU, Chun-Hung LIN
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Publication number: 20210301426Abstract: A fiber masterbatch including a polyetherimide, a polyethylene terephthalate, and a polyimide is provided. A glass transition temperature of the polyimide is between 140° C. and 170° C., a 10% thermogravimetric loss temperature of the polyimide is between 500° C. and 550° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and a solid content of the polyimide is 15 wt %, a viscosity of the polyimide is between 80 cP and 230 cP. A melt spun fiber obtained by using the fiber masterbatch is also provided.Type: ApplicationFiled: September 29, 2020Publication date: September 30, 2021Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin, Yuan-Pei Liao, Yi-Cang Lai
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Publication number: 20210122880Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.Type: ApplicationFiled: December 31, 2020Publication date: April 29, 2021Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin
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Patent number: 10975202Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.Type: GrantFiled: February 25, 2019Date of Patent: April 13, 2021Assignee: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin
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Publication number: 20210102321Abstract: A meltblown nonwoven fabric is provided. The meltblown nonwoven fabric includes a plurality of meltblown fibers adhered to each other. The material of each of the meltblown fibers includes a polyetherimide and a polyimide, or the material of each of the meltblown fibers includes a polyphenylene sulfide and a polyimide, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP.Type: ApplicationFiled: February 5, 2020Publication date: April 8, 2021Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin, Yuan-Pei Liao, Yi-Cang Lai
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Publication number: 20210017382Abstract: A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.Type: ApplicationFiled: September 12, 2019Publication date: January 21, 2021Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin, Yuan-Pei Liao, Yi-Cang Lai
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Publication number: 20200055988Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.Type: ApplicationFiled: February 25, 2019Publication date: February 20, 2020Applicant: Taiwan Textile Research InstituteInventors: Shang-Chih Chou, Shao-Yen Chang, Chun-Hung Lin