Abstract: A printed circuit board including a series-wound inductor and two capacitors to reduce the susceptibility of a printed circuit board to simultaneous switching noise includes a ground layer; a power layer defining a slot loop to isolate a metal plate within, and a via hole coupled between the metal plate and the ground layer. An electronic device with the printed circuit board is also disclosed.

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract: An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure.

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract: A system and a method for converting between data formats converts air flow data from a thermal simulation tool into a format readable by a DC power analyzing tool. Air flow data associated with the locations of certain points on a printed circuit board are taken and an EXCEL document including Main, Data, and Final worksheets is created. The data to be converted is obtained, and the data imported into the Data worksheet. Parameters in the Main worksheet to set an analysis area of the printed circuit board are set, and air flow data associated with the analysis areas from the Data worksheet are obtained and divided into groups, according to the parameters set in the Main worksheet. An equivalence value for each group of data is calculated and the equivalence values are saved in the Final worksheet for reading by the DC power analyzing tool.

Abstract: An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure.

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract: A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically connected between the metal board and the power layer. The power layer is made of a number of wires.